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ADG1433YRUZ-REEL is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SPDTX3 4.7OHM 16TSSOP. Review the specifications below when checking this part for your BOM.
The ADG1433YRUZ-REEL is a monolithic industrial CMOS (iCMOS) analog switch featuring three independently selectable single-pole, double-throw (SPDT) channels. It operates with fully specified ±15 V, +12 V, and ±5 V supplies. The device exhibits a maximum on resistance of 4.7 Ω at 25°C with 0.5 Ω flatness. Digital inputs are compatible with 3 V logic. Continuous current per channel reaches up to 115 mA. The component supports rail-to-rail operation and includes an enable input for power-down control. It is housed in a 16-lead TSSOP package.
Verify the specific ordering suffix REEL against the manufacturer's official documentation to confirm tape-and-reel packaging specifications. Ensure the Y version temperature range meets the operational requirements. Cross-reference the pinout configuration for the 16-lead TSSOP package to validate board layout compatibility before finalizing procurement orders.
Select this component when designing circuits requiring low distortion and high voltage handling in a compact footprint. The iCMOS technology offers significantly lower power consumption compared to conventional CMOS processes. Consider the 3 V logic compatibility for interfacing with modern microcontrollers without additional level shifting circuitry.
This part belongs to the ADG1433/ADG1434 family of high-voltage analog switches. The ADG1433 variant specifically integrates three SPDT switches, whereas the ADG1434 provides four. Both share the same iCMOS architecture and electrical characteristics, differing primarily in channel count and pin configuration within the available package options.
Direct substitutes include the ADG1433YRUZ tube version or other members of the ADG14xx series such as the ADG1408 or ADG1436, provided the channel count and package type align with the design constraints.
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