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ADG509FBRNZ is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SWITCH SP4T X 2 270OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The ADG509FBRNZ is a CMOS analog multiplexer featuring four differential channels in a 16-lead SOIC package. It provides fault protection by withstanding continuous overvoltage inputs from −40 V to +55 V, even during power loss. The device operates on dual supplies ranging from 10.8 V to 16.5 V (±5.4 V to ±8.25 V) or a single supply of 10.8 V to 16.5 V. Key electrical parameters include a maximum on-resistance of 390 Ω and a typical value of 270 Ω at ±15 V. Switching times are specified with a maximum tON of 230 ns and tOFF of 130 ns. Leakage currents are typically ±0.04 nA when on and ±1 nA when off. The component supports an industrial temperature range of −40°C to +85°C.
Verify the specific suffix 'NZ' indicates RoHS compliance as documented in the ordering guide. Confirm the package option corresponds to the 16-Lead SOIC_N (R-16) physical dimensions. Ensure the voltage requirements align with the specified dual or single supply ranges for the intended application environment.
Select this model for applications requiring differential signal routing with robust overvoltage tolerance. Compare the 390 Ω maximum on-resistance against system signal integrity requirements. Verify that the 230 ns maximum switching time meets the speed constraints of the data acquisition or control loop.
The ADG509FBRNZ belongs to the ADG508F/ADG509F series of fault-protected analog multiplexers manufactured by Analog Devices. This series utilizes iCMOS technology to provide high reliability and protection features not found in standard multiplexers. The F variant specifically denotes the fault-protected version with extended voltage handling capabilities.
Publicly confirmed substitute part numbers include ADG509FBRUZ and ADG509FBRWZ. These alternatives share the same functional specifications but differ in package type, such as TSSOP or wide-body SOIC.
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