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ADG5412FBCPZ-RL7 is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC SW SPST-NOX4 11.5OHM 16LFCSP. Review the specifications below when checking this part for your BOM.
The ADG5412FBCPZ-RL7 is a quad single-pole/single-throw (SPST) analog switch from Analog Devices, housed in a 16-lead LFCSP package. It features overvoltage protection up to ±55 V on source pins and power-off protection within the same range. The device operates with dual supplies of ±5 V to ±22 V or a single supply of 8 V to 44 V. Key electrical parameters include a maximum on-resistance of 37 Ω at 12 V single supply and 11.2 Ω at ±15 V dual supply. Maximum turn-on time is 545 ns, while maximum turn-off time is 510 ns. The component supports an operating temperature range from -40°C to +125°C.
Verify the specific suffix BCPZ corresponds to the 16-lead LFCSP package variant when sourcing. Confirm that the RL7 designation indicates reel packaging. Ensure compatibility with the required voltage rails and thermal management strategies for the LFCSP footprint before finalizing procurement orders.
Select this component for applications requiring bidirectional switching with robust fault protection. The ADG5412F turns on with Logic 1 inputs, distinguishing it from the ADG5413F which has mixed logic states. Consider the 16-lead LFCSP package for its superior thermal dissipation compared to TSSOP options. Verify that the ±55 V protection rating meets the system's transient voltage requirements.
This part belongs to the ADG5412F/ADG5413F series of fault-protected analog switches. It shares functional similarities with the ADGS5412 but lacks SPI interface capabilities, relying instead on parallel digital inputs. The LFCSP package offers a compact form factor suitable for space-constrained PCB layouts while maintaining high thermal performance.
The ADG5412FBRUZ-RL7 serves as a direct pin-compatible alternative in a 16-lead TSSOP package. Designers must account for differences in thermal resistance and physical dimensions when substituting between LFCSP and TSSOP variants.
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