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ADG608BN is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC MUX 8:1 30OHM 16DIP. Review the specifications below when checking this part for your BOM.
The ADG608BN is a monolithic CMOS analog multiplexer featuring eight single channels. It operates from +3 V, +5 V, or ±5 V supplies with an analog signal range extending from VSS to VDD. Key electrical parameters include a maximum on-resistance of 30 Ω and switching times of 75 ns (tON) and 45 ns (tOFF). The device offers low power dissipation of 1.5 mW max, break-before-make switching, and TTL/CMOS compatible inputs.
Verify the specific suffix 'BN' corresponds to the Plastic DIP-16 package and the industrial temperature range of -40 °C to +85 °C as defined in the Analog Devices ordering guide. Confirm that the component meets the required RoHS status and lead-free specifications for the target assembly process. Cross-reference the manufacturer part number with authorized distributors to ensure authenticity and traceability.
Select the ADG608BN when an 8-channel single-ended multiplexer is required with TTL-compatible control logic. This variant is suitable for designs utilizing plastic DIP packaging and industrial temperature environments. Ensure the application voltage does not exceed the specified limits for the chosen supply configuration and that the on-resistance characteristics meet the signal integrity requirements.
The ADG608BN belongs to the ADG608/ADG609 family of high-performance analog multiplexers manufactured by Analog Devices. These devices are designed using an enhanced LC2MOS process to provide low power dissipation alongside high switching speed. The ADG608 specifically provides eight single channels, whereas the companion ADG609 offers four differential channels within the same functional architecture.
The ADG608BR serves as a direct pin-compatible alternative offering the same electrical performance but housed in a Small Outline IC (SOIC) package. For applications requiring extended temperature ranges up to +125 °C, the ADG608TRU variant provides equivalent functionality in a Thin Shrink Small Outline Package (TSSOP).
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