ADG936BCP-REEL7

Overview

The ADG936BCP-REEL7 is a wideband RF switch IC manufactured by Analog Devices Inc., featuring an absorptive dual SPDT configuration. It operates on a single 1.65 V to 2.75 V supply and utilizes CMOS/LVTTL control logic. The device provides high off-isolation of 36 dB at 1 GHz and low insertion loss of 0.9 dB from DC to 1 GHz, with a -3 dB bandwidth extending to 4 GHz. It is housed in a 20-lead LFCSP (4 mm × 4 mm) package and supports operation temperatures from -40°C to +85°C.

Feature Summary

• Absorptive dual SPDT architecture for improved port-to-port isolation
• Wideband performance with -3 dB cutoff at 4 GHz
• Low power consumption with 100 nA operating current
• Compatible with standard CMOS and LVTTL control logic levels

Applications

• Wireless communication infrastructure equipment
• Test and measurement instrumentation
• RF signal routing in multi-standard transceivers
• Base station antenna switching systems

Procurement Notes

Verify the specific suffix REEL7 confirms tape-and-reel packaging when sourcing. Ensure the component matches the LFCSP-20 footprint dimensions. Confirm RoHS compliance status through official manufacturer documentation prior to integration into production assemblies.

Selection Notes

Select this component for designs requiring absorptive switching characteristics to minimize reflections. It is suitable for applications needing wideband coverage up to 4 GHz with minimal insertion loss. Consider the low voltage supply requirement and small form factor for portable or dense PCB layouts.

Part Context

This part belongs to the ADG936 series of wideband RF switches. It differs from reflective variants like the ADG936-R by utilizing absorptive technology to enhance isolation between ports. The BCPSuffix indicates a specific temperature grade and package variant within the Analog Devices portfolio.

Replacement Considerations

The ADG936BRU-REEL7 serves as a functional alternative within the same family, offering similar electrical specifications but potentially differing in package type or manufacturing lot details. Verify pin compatibility and thermal requirements before substitution.