ADN2820ACHIPS

Overview

The ADN2820ACHIPS is a high-performance SiGe transimpedance amplifier (TIA) die designed for 10.7 Gbps optical systems. It operates on a single 3.3 V supply and features a 9 GHz bandwidth with low input referred noise current of 1.0 µA. The device provides differential outputs with a transimpedance gain of 5000 V/A, capable of driving CDRs directly. An integrated POWMON output enables average input power monitoring at 1 V/mA sensitivity. The OFFSET control input allows slice level adjustment for asymmetric signals. Operating ambient temperature ranges from –25°C to +85°C.

Feature Summary

• High-speed SiGe technology optimized for 10.7 Gbps metro-access and Ethernet applications
• Integrated average power monitor providing linear analog signal proportional to input current
• Differential output architecture enabling direct connection to clock data recovery circuits
• Adjustable output offset control for optimizing input slice levels in long-reach links

Applications

• 10.7 Gbps optical modules
• SONET/SDH OC-192/STM-64 receivers
• 10 GbE transceivers and transponders

Procurement Notes

Verify the specific ordering suffix matches the required temperature range and package configuration. Confirm that the bare die form factor aligns with your assembly capabilities and substrate requirements. Ensure proper ESD handling protocols are implemented during procurement and storage due to the sensitivity of the silicon germanium components.

Selection Notes

Select this component when designing compact, high-bandwidth optical front-ends requiring integrated power monitoring. Evaluate bond wire inductance constraints carefully, as bandwidth performance is highly sensitive to input and output parasitic inductances. Consider the need for external low-frequency cutoff capacitors if digital encoding requires extended passband response below standard frequencies.

Part Context

This part belongs to Analog Devices' portfolio of high-speed optical interface solutions. It serves as a critical front-end receiver stage in fiber optic communication networks. The die format allows system integrators to customize packaging and interconnect strategies within butterfly or other specialized optical module housings.

Replacement Considerations

No public confirmed substitute part numbers are available.