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The ADN3010-11-50A-DF is a bare die optical receiver designed for data rates up to 11.3 Gbps. It integrates a 50 µm diameter germanium photodiode with a silicon transimpedance amplifier and limiting amplifier. The device operates on a single 3.3 V supply, consuming approximately 102 mW. It features an antireflective coating optimized for the O band (1270 nm to 1330 nm). Key electrical parameters include a differential output swing of 460 mV p-p at 10.52 Gbps, input sensitivity of −16.5 dBm OMA, and a power monitor output slope of 1.0 A/W. The die dimensions are 0.835 mm by 0.675 mm.
Verify that the specific ordering suffix DF corresponds to the 6-inch film frame packaging configuration as defined in the official Analog Devices ordering guide. Confirm that the component is supplied as a bare die requiring specialized assembly processes, including die attach and wire bonding, rather than a standard packaged IC. Ensure compatibility with the C-11-1 package outline and pad configuration before procurement.
Select this component when designing high-speed optical receivers requiring integrated photodetection and amplification in a compact form factor. The device is suitable for applications needing operation across the extended industrial temperature range of −40°C to +85°C. Consider the availability of the film frame packaging option if automated die handling is required for manufacturing.
This part belongs to the ADN3010-11 series of high-speed optical receivers manufactured by Analog Devices Inc. The series provides solutions for short-reach optical interconnects by combining detection and signal conditioning on a single chip. The ADN3010-11-50A-DF variant specifically denotes the version packaged in a 6-inch film frame for die-level distribution.
Public confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence with other ADN3010 variants based on specific packaging requirements such as reel or waffle pack options.