ADN3010-11-50A-RL7

Overview

The ADN3010-11-50A-RL7 is a high-speed optical receiver die featuring an integrated SiGe PIN photodiode, transimpedance amplifier (TIA), and limiting amplifier (LA). It supports data rates up to 11.3 Gbps with a 50 µm diameter germanium photodetector. Operating on a single 3.3 V supply, it consumes approximately 49 mA. The device provides differential CML outputs with a swing of 460 mV p-p at 10.52 Gbps. Input sensitivity reaches −16.5 dBm OMA at 25°C. An on-chip power monitor output allows for optical coupling verification.

Feature Summary

• Monolithic integration of a large-area germanium photodiode with silicon TIA and LA eliminates bond wires for improved reliability.
• Includes an on-chip power monitor function providing proportional voltage or current output for alignment verification.
• Features an antireflective coating optimized to 1310 nm while supporting the full O-band wavelength range.

Applications

• Optical module receivers up to 11.3 Gbps
• Short-range 10 Gb SONET, Fibre Channel, Ethernet, CPRI, OBSAI, and LTE optical receivers
• Integration into ROSA, BOSA, or MCM packages

Procurement Notes

Verify the specific ordering suffix -RL7 corresponds to the 11-pad bare die in tape and reel packaging containing 5,000 units per reel. Confirm the package option is C-11-1. Ensure compatibility with the specified extended industrial temperature range of −40°C to +85°C during component selection.

Selection Notes

Select this component for designs requiring a compact, high-speed optical receiver solution with integrated photodetection. The 50 µm photodiode diameter facilitates easy coupling with single-mode fiber. Consider the differential CML output interface requirements and the necessity for AC coupling on the output lines when designing the host circuitry.

Part Context

This part belongs to the ADN3010-11 series of 11.3 Gbps optical receivers manufactured by Analog Devices. It is designed as a bare die solution intended for integration into larger optical subassemblies rather than standalone PCB mounting. The series focuses on high-performance signal recovery for short-reach optical communication standards.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing optical coupling mechanisms and host driver interfaces before considering alternative components.

FAQ

What is the purpose of the PM pin?

The PM (Power Monitor) pin provides a voltage or current output proportional to the sensed average photocurrent, allowing users to verify optical alignment and coupling efficiency during manufacturing.

What is the recommended bonding sequence?

To reduce ESD stress, the recommended sequence starts with Ground pads, followed by VCC, then PM, and finally the Output pins, as detailed in the datasheet's bonding section.