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The ADN3010-11-50A-S10 is a bare die optical receiver operating at data rates up to 11.3 Gbps. It integrates a 50 µm diameter germanium photodiode with a silicon transimpedance amplifier and limiting amplifier. The device operates on a single 3.3 V supply, consuming approximately 102 mW. It features an antireflective coating optimized for the O band (1270 nm to 1330 nm). Input sensitivity reaches −16.5 dBm OMA at 10.52 Gbps with a BER of 10⁻¹². The differential output swing is 460 mV p-p, and it functions within an extended industrial temperature range of −40°C to +85°C.
Verify that the specific suffix S10 corresponds to the requested packaging format, as official documentation lists DF, RL7, and WP options. Confirm the component status remains active or obsolete before procurement planning. Ensure assembly capabilities match the bare die specifications, including die attach and bonding sequences. Validate that the ordering quantity aligns with manufacturer constraints for the selected package type.
Select this component when designing high-speed optical links requiring integrated photodetection without external diodes. The 50 µm detector diameter facilitates coupling with single-mode fibers. Consider the extended industrial temperature range for harsh environments. Evaluate the power monitor utility for manufacturing alignment processes. Ensure the system supports the required 3.3 V supply and handles the specified differential output impedance.
This part belongs to the ADN3010 series of high-speed optical receivers from Analog Devices. It is designed for short-reach optical interconnects. The device represents a compact solution by integrating multiple functional blocks onto a single semiconductor die. It serves as a core component in advanced optical subassemblies where size and performance are critical constraints.
Public confirmed substitute part numbers: None identified in source material.
The PM pin provides a voltage or current output proportional to the sensed average photocurrent, allowing users to verify fiber alignment and optical coupling during manufacturing.
The datasheet recommends a specific bonding sequence starting with ground pads to reduce ESD or electronics stress introduced by the bonding tip.
The typical power consumption is 102 mW when operating from a single 3.3 V supply.