RF Amplifiers ADPA7009CHIP product image

ADPA7009CHIP

  • Description:IC RF AMP GPS 20GHZ-54GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:9dadb5893e37 Category: Brand:

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ADPA7009CHIP is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC RF AMP GPS 20GHZ-54GHZ DIE. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for ADPA7009CHIP

  • Description:IC RF AMP GPS 20GHZ-54GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Frequency:20GHz ~ 54GHz
  • P1dB:28.5dBm
  • Gain:20.5dB
  • Noise Figure:6dB
  • RF Type:General Purpose
  • Voltage - Supply:3V ~ 5V
  • Current - Supply:750mA
  • Test Frequency:24GHz ~ 36GHz
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for ADPA7009CHIP

ADPA7009CHIP

RF Amplifiers Overview

The ADPA7009CHIP is a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) monolithic microwave integrated circuit (MMIC) power amplifier. It operates within a frequency range of 20 GHz to 54 GHz. The device provides a typical gain of 19.5 dB and delivers a saturated output power (Psat) of 29 dBm (0.5 W). At the 1 dB compression point (P1dB), the output power is 28.5 dBm across the 24 GHz to 36 GHz band. The input third-order intercept point (IP3) typically reaches 35 dBm in the same frequency range. The amplifier requires a 5 V supply voltage and draws 750 mA of current. Input and output impedances are internally matched to 50 ohms.

RF Amplifiers Feature Summary

  • Utilizes GaAs pHEMT MMIC technology for high-frequency performance
  • Features internal 50-ohm input and output matching for easy integration
  • Designed for distributed power amplifier architecture

RF Amplifiers Applications

  • Military systems
  • Aerospace applications
  • Test instrumentation

RF Amplifiers Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm that the specific package type matches design requirements, as the device utilizes RF pads connected via bond wires. Check for obsolescence status, as availability may be limited. Ensure thermal management solutions align with the 750 mA operating current and 5 V supply conditions specified in the official datasheet.

RF Amplifiers Selection Notes

Select this component when a wideband 20 GHz to 54 GHz coverage is required. The internal 50-ohm matching simplifies circuit design compared to unmatched variants. Consider the 750 mA current draw for power budget calculations. Evaluate the 29 dBm Psat against system link budget requirements. Verify compatibility with multi-chip module (MCM) integration strategies due to the bare die or specialized packaging nature of MMICs.

RF Amplifiers Part Context

This part belongs to the ADPA7009 series of GaAs pHEMT MMICs from Analog Devices. It serves as a core active element for high-frequency signal amplification. The series is engineered for robust performance in demanding environments. Related components include development kits like the ADPA7009C-KIT for evaluation purposes. The technology leverages advanced semiconductor processes to achieve high linearity and efficiency at millimeter-wave frequencies.

RF Amplifiers Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Due to the specific MMIC architecture and proprietary GaAs process, direct pin-to-pin replacements may not exist. Engineers should consult Analog Devices technical support for potential alternative devices within the portfolio that meet similar frequency and power specifications.

ADPA7009CHIPADPA7009CHIP

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