ADR225HFZ

Overview

The ADR225HFZ is a high-temperature, micropower 2.5 V band gap voltage reference designed for extreme environments. It operates from −40°C to +210°C in an 8-lead ceramic flat pack package. The device features a maximum temperature coefficient of 40 ppm/°C and an initial accuracy of ±0.4% (±10 mV). It draws a maximum supply current of 60 µA and supports a wide input voltage range of 3.3 V to 16 V with a maximum dropout voltage of 1.0 V at 10 mA load.

Feature Summary

• Extreme high temperature operation up to 210°C
• Micropower core topology for low supply current
• Laser trimmed thin film resistors for stability
• Robust performance qualified for extended operating life

Applications

• Down-hole drilling and instrumentation
• Avionics systems
• Heavy industrial equipment
• High temperature sensor signal conditioning

Procurement Notes

Verify the specific ordering suffix HFZ corresponds to the 8-lead Ceramic Flat Package (F-8-2) variant when sourcing. Confirm RoHS compliance status as indicated by the Z suffix. Ensure the application environment does not exceed the absolute maximum junction temperature or soldering thermal limits specified in the datasheet to maintain device reliability.

Selection Notes

Select this component when applications require stable voltage references in environments exceeding standard commercial temperature ranges. The FLATPACK package provides superior thermal endurance compared to SOIC variants. Consider the 40 ppm/°C temperature coefficient and 60 µA maximum supply current specifications against system power and precision requirements.

Part Context

The ADR225HFZ belongs to Analog Devices' high-temperature product series, specifically engineered for robustness at extreme temperatures. It utilizes a micropower band gap architecture with laser trimming. This part is distinct from the ADR225HRZN, which uses an SOIC package and is rated for a lower maximum operating temperature of 175°C.

Replacement Considerations

The ADR225HRZN serves as a functional substitute within the same family but is limited to a maximum operating temperature of 175°C and utilizes an SOIC package. Verify that the thermal requirements of the target application align with the reduced temperature rating of the alternative package option.