ADRF5050BCCZN

RF Switches Overview

The ADRF5050BCCZN is a nonreflective silicon SP4T RF switch IC from Analog Devices, operating from 100 MHz to 20 GHz. It features an insertion loss of 1.2 dB and operates on a supply voltage between 3.15 V and 3.45 V with a quiescent current of 155 uA. The device utilizes a 24-pin LGA (3x3) package and supports temperatures from -40°C to +105°C. It includes on-chip 50 Ω terminations for nonreflective performance.

RF Switches Feature Summary

• Nonreflective design architecture incorporating integrated on-chip 50 Ω terminations
• Silicon-based single-pole four-throw (SP4T) switching topology
• Low power consumption suitable for battery-operated wireless systems

RF Switches Applications

• Wireless communication infrastructure
• Radar and satellite communication systems
• Test and measurement equipment

RF Switches Procurement Notes

Verify the specific suffix 'BCCZN' against the manufacturer's official datasheet to confirm pinout and termination specifications. Ensure compatibility with the required 24-LGA footprint during PCB layout. Confirm that the 100 MHz to 20 GHz frequency range meets system requirements before integration.

RF Switches Selection Notes

Select this component when nonreflective signal paths are critical to minimize standing wave ratio in high-frequency designs. The integrated 50 Ω terminations simplify circuit design by eliminating external matching networks. Consider the 1.2 dB insertion loss and 155 uA current draw relative to system power budgets and signal integrity needs.

RF Switches Part Context

This part belongs to the ADRF5050 series of wideband RF switches. It shares the LGA-24 package form factor with other devices in the family but is distinguished by its specific 20 GHz upper frequency limit and nonreflective termination characteristics. It serves as a specialized solution for broadband applications requiring low reflection coefficients.

RF Switches Replacement Considerations

The ADRF5050BCCZN-R7 is a reel-packaged variant of the same functional device. Verify if tape-and-reel handling is preferred over cut-tape or tube packaging for assembly processes. No alternative functional substitutes are confirmed in the provided documentation.