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ADRV9009BBCZ-REEL is listed in the RF Transceiver Modules And Modems range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is RF TXRX MODULE CELL SMD. Review the specifications below when checking this part for your BOM.
The ADRV9009BBCZ-REEL is an integrated dual RF transceiver from Analog Devices, designed for high-performance wireless applications. It operates within a frequency range of 75 MHz to 6 GHz and supports a maximum data rate of 12.288 Gb/s. The device features two receivers and two transmitters, housed in a BGA-196 package with SMD/SMT mounting style. It functions on power supply voltages between 1.267 V and 3.465 V, with receive current at 1.645 A and transmit current at 2.1 A. The component is rated for operating temperatures from -40 C to +85 C and is supplied in Reel packaging.
Verify the specific suffix designation against official Analog Devices documentation to confirm packaging configuration and handling requirements. Ensure compatibility with existing board layouts and thermal management strategies before integration. Cross-reference the part number with current manufacturer availability status, as distribution channels may indicate limited stock or restricted supply conditions. Confirm RoHS compliance details through the official datasheet prior to final procurement approval.
Select this component when designing systems requiring dual-channel RF connectivity within the 75 MHz to 6 GHz spectrum. Evaluate power budget constraints against the specified receive and transmit current values to ensure adequate supply regulation. Consider the BGA-196 package dimensions and thermal dissipation characteristics during mechanical design. Verify that the target application protocol aligns with the device's digital interface and signal processing capabilities for optimal system integration.
This part belongs to the ADRV9009 series of highly integrated radio solutions from Analog Devices. It represents a specialized class of wideband transceivers engineered for modern telecommunications standards. The series focuses on providing flexible RF front-end solutions that reduce bill-of-materials complexity by integrating multiple functions into a single silicon die.
Public confirmed substitute part numbers are not available in the provided documentation.
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