ADS122C04IPW

Overview

The ADS122C04IPW is a 24-bit, low-power analog-to-digital converter (ADC) from Texas Instruments, housed in a 16-pin TSSOP package. It features a sigma-delta architecture with an integrated multiplexer supporting two differential or four single-ended inputs. The device includes a programmable gain amplifier (PGA) with gains up to 128, a precision internal voltage reference of 2.048 V, and two programmable excitation current sources (iDACs). It operates on a single supply voltage ranging from 2.3 V to 5.5 V for both analog and digital domains. Data conversion occurs at rates up to 2 kSPS, with the digital filter providing simultaneous 50 Hz and 60 Hz rejection at 20 SPS. Communication is handled via an I2C-compatible interface supporting speeds up to 1 Mbps.

Feature Summary

• Integrated signal chain components including PGA, iDACs, and temperature sensor reduce external component count.
• Flexible input configuration supports multiple sensor types through MUX-PGA-ADC architecture.
• High noise immunity with digital filtering capabilities for industrial environments.
• Compact surface-mount packaging suitable for space-constrained designs.

Applications

• Resistance Temperature Detector (RTD) measurement systems
• Thermocouple signal conditioning
• Thermistor and resistive bridge sensor interfaces
• Low-power portable instrumentation

Procurement Notes

Verify the specific suffix IPW indicates the TSSOP-16 package variant when sourcing. Confirm RoHS compliance status as per the latest manufacturer documentation. Ensure compatibility with the required operating temperature range of -40°C to +125°C for your application environment. Check for any recent product change notifications regarding pinout or electrical characteristics before finalizing procurement.

Selection Notes

Select this component when high resolution and low power consumption are critical for sensor applications. The integrated PGA eliminates the need for external amplifiers for small signals. Consider the I2C interface constraints if multiple devices share the bus. Evaluate the thermal performance within the TSSOP-16 package for high-temperature operation scenarios.

Part Context

This part belongs to the ADS122C04 series, which offers various package options including WQFN and TSSOP. The IPW suffix specifically denotes the 16-lead Thin-Shrink Small-Outline Package (TSSOP). This series is designed to replace discrete ADC solutions by integrating necessary analog front-end functions into a single chip.

Replacement Considerations

Direct pin-to-pin replacements may include other variants within the ADS122C family, such as ADS1222 or ADS1220, depending on channel count requirements. Verify that substitute parts maintain the same I2C addressability and register compatibility for seamless integration.