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The ADS1282SKGDA is a die-level Delta-Sigma analog-to-digital converter manufactured by Texas Instruments. It features two independent ADC channels with a resolution of 31 bits and a maximum sampling rate of 4 kS/s per channel. The device utilizes an SPI digital interface for data communication. It operates with an analog supply voltage range of 4.75 V to 5.25 V and a digital supply voltage range of 1.65 V to 3.6 V. Key performance metrics include a signal-to-noise ratio (SNR) of 124 dB and an integral nonlinearity (INL) of 0.01% FSR. The component includes an integrated programmable gain amplifier (PGA) and requires an external reference voltage, typically around 4.75 V. It supports an operating temperature range from -55°C to +210°C.
This item is sold as a bare die rather than a packaged component. Buyers must verify export compliance requirements, as the product may require additional documentation for shipment from the United States. Ensure that the manufacturing facility has the necessary capabilities for die attachment and wire bonding integration into custom substrates or packages.
Select this part when board space is constrained and custom packaging is required. Verify compatibility with the target substrate material and wire bonding processes. Confirm that the external reference circuit meets the specified voltage stability requirements to maintain the advertised SNR and linearity specifications across the full temperature range.
The ADS1282SKGDA belongs to the ADS1282 family of precision analog-to-digital converters. Unlike the packaged variants such as the ADS1282IPW or ADS1282IPWR, this SKGDA suffix denotes a raw silicon die intended for flip-chip or wire-bond integration into specialized modules. It shares the same core architecture and electrical characteristics as its packaged counterparts.
For packaged replacements, consider the ADS1282IPW or ADS1282IPWR. These components offer identical electrical performance but are housed in 28-pin TSSOP packages, simplifying PCB assembly and eliminating the need for custom die-attachment processes.