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ADTL2-18+ is listed in the Balun range at ChipApex. The manufacturer field lists Mini-Circuits. Its product description is 1:2 CORE & WIRE TRANSFORMER, 30. Review the specifications below when checking this part for your BOM.
The ADTL2-18+ is a surface-mount RF transformer (balun) from Mini-Circuits, designed for broadband signal conversion. It operates within a frequency range of 30 MHz to 1.8 GHz and maintains a 50 Ohm impedance on both primary and secondary sides. The device features a 1:2 impedance transformation ratio and utilizes a balanced transmission line architecture. Key electrical characteristics include a typical amplitude unbalance of 0.3 dB and phase unbalance of 3 degrees within the 1 dB bandwidth. Maximum ratings specify an operating temperature range of -20°C to +85°C, with a maximum DC current of 30 mA and a power rating of 250 mW.
Verify the specific suffix (+) indicates compliance with current environmental standards as defined by the manufacturer. Confirm that the 6-SMD flat lead package matches the intended footprint on the target printed circuit board. Ensure that the maximum DC current and power ratings are not exceeded during system operation to prevent permanent damage. Cross-reference the datasheet revision date to ensure all electrical specifications align with the latest production batch requirements.
Select this component when a broadband solution is required for frequencies extending up to 1.8 GHz. The 1:2 impedance ratio makes it suitable for converting between single-ended and differential lines with specific impedance constraints. Consider the physical dimensions of 7.87 mm x 5.59 mm x 2.84 mm for space-constrained designs. Evaluate the thermal performance against the specified operating temperature limits of -20°C to +85°C for the intended application environment.
The ADTL2-18+ belongs to the ADTL series of audio and signal transformers manufactured by Mini-Circuits. This series focuses on providing reliable RF signal conditioning components for wireless communication systems. The device represents a transition toward surface-mount technology in high-frequency applications, replacing older through-hole variants while maintaining similar electrical performance profiles for broadband impedance transformation tasks.
Public confirmed substitute part numbers are not available in the provided documentation.
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