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AF008GEC5A-2001A3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 64GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF008GEC5A-2001A3
- Description：IC FLASH 64GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：64Gbit
- Memory Organization：8G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF008GEC5A-2001A3
Memory IC Overview
The AF008GEC5A-2001A3 is a 64 Gbit (8 GB) NAND flash memory component manufactured by ATP Electronics, Inc. It utilizes eMMC 5.1 interface technology with HS400 mode support, achieving sequential write speeds of 240 MB/s. The device is packaged in a 153-BGA (11.5x13 mm) form factor and employs 3D MLC NAND technology. Designed for automotive applications, it holds AEC-Q100 Grade 3 certification and operates within an extended temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Built-in wear leveling function to extend device lifespan
- ECC error correction function for data integrity
- Power-down data protection mechanism
Memory IC Applications
- Automotive infotainment systems
- Telematics control units
- Digital instrument clusters
- Advanced driver-assistance systems (ADAS)
Memory IC Procurement Notes
Verify the specific suffix codes against official ATP documentation to confirm exact capacity, speed grade, and package variations. Ensure that any ordering suffixes do not alter the functional specifications or electrical characteristics unless explicitly stated in the manufacturer's datasheet. Cross-reference the part number with current availability status as automotive-grade components may have distinct supply chain constraints.
Memory IC Selection Notes
Select this component when an automotive-grade storage solution is required that meets AEC-Q100 Grade 3 standards. The choice is driven by the need for reliable operation in harsh thermal environments ranging from -40°C to +85°C. The eMMC 5.1 interface provides a standardized solution for embedded multimedia card applications in vehicle electronics.
Memory IC Part Context
This part belongs to ATP Electronics' industrial and automotive-grade memory portfolio. It integrates NAND flash memory with a built-in controller to manage data storage and retrieval efficiently. The 153-ball BGA package allows for compact integration into space-constrained automotive electronic control units while maintaining robust performance under vibration and thermal stress.
Memory IC Replacement Considerations
Consult ATP Electronics for direct cross-references. Verify compatibility regarding pinout, voltage levels, and interface protocol before substituting with other eMMC devices. Ensure any alternative component also meets AEC-Q100 Grade 3 requirements for automotive deployment.
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