Memory IC AF008GEC5A-2001EX product image

AF008GEC5A-2001EX

$14.61
  • Description:IC FLASH 64GBIT EMMC 153BGA
  • Series:Ex-Temp
  • Mfr:ATP Electronics, Inc.
  • Package:Tray

SKU:7aa738805db6 Category: Brand:

  
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AF008GEC5A-2001EX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 64GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AF008GEC5A-2001EX

  • Description:IC FLASH 64GBIT EMMC 153BGA
  • Series:Ex-Temp
  • Mfr:ATP Electronics, Inc.
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NAND (pSLC)
  • Memory Size:64Gbit
  • Memory Organization:8G x 8
  • Memory Interface:eMMC
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-40°C ~ 105°C
  • Mounting Type:Surface Mount
  • Package / Case:153-FBGA
  • Supplier Device Package:153-BGA (11.5x13)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AF008GEC5A-2001EX

AF008GEC5A-2001EX

Memory IC Overview

The AF008GEC5A-2001EX is a non-volatile NAND flash memory IC manufactured by ATP Electronics, Inc. It features a 64 Gbit (8 GB) capacity and utilizes pSLC technology for enhanced reliability. The component is housed in a 153-ball FBGA package measuring 11.5 x 13 mm. It operates within an extended industrial temperature range of -40°C to +105°C. Key functional attributes include built-in wear leveling and ECC error correction to ensure data integrity.

Memory IC Feature Summary

  • Built-in wear leveling function for extended device lifespan
  • ECC error correction capability for data accuracy
  • Power-down data protection mechanism

Memory IC Applications

  • Industrial embedded storage systems
  • Automotive electronic control units
  • Ruggedized mobile computing devices

Memory IC Procurement Notes

Verify the specific revision level and packaging configuration against the official ATP datasheet before procurement. Confirm that the 153-ball FBGA footprint matches the target PCB design. Ensure environmental compliance requirements align with RoHS3 standards. Cross-reference the manufacturer part number to avoid confusion with similar eMMC variants.

Memory IC Selection Notes

Select this component when high endurance and wide temperature tolerance are required for embedded applications. The pSLC configuration offers superior write performance and retention compared to standard MLC options. Consider the 153-ball package size constraints during mechanical design. Validate interface compatibility with the host controller's eMMC protocol support.

Memory IC Part Context

This part belongs to ATP’s industrial-grade eMMC memory series, designed for demanding environments. It integrates NAND flash controllers with management algorithms to simplify system integration. The product line emphasizes stability and longevity over raw speed, targeting sectors where data loss is not an option.

Memory IC Replacement Considerations

Direct substitutes must match the 153-ball FBGA package and 64 Gbit capacity. Verify pinout compatibility and electrical specifications with alternative vendors. Check for equivalent industrial temperature ratings and pSLC technology implementation.

AF008GEC5A-2001EXAF008GEC5A-2001EX
$14.61
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