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AF010GEC5A-2004CX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 10GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF010GEC5A-2004CX
- Description：IC FLASH 10GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：-
- Memory Size：10Gbit
- Memory Organization：-
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF010GEC5A-2004CX
Memory IC Overview
The ATP Electronics AF010GEC5A-2004CX is a 10GB eMMC flash memory device housed in a 153-ball FBGA package. It supports the eMMC 5.1 specification with HS400 interface capability, achieving sequential write speeds of 140 MB/s. The component operates within a supply voltage range of 2.7V to 3.6V. Designed for commercial temperature applications, it integrates NAND flash technology for high-density data storage in embedded systems requiring reliable non-volatile memory solutions.
Memory IC Feature Summary
- Supports eMMC 5.1 standard with HS400 interface for high-speed data transfer
- Provides 10GB capacity for substantial embedded data storage requirements
- Utilizes 153-ball FBGA package for compact board integration
Memory IC Applications
- Embedded multimedia card systems
- Commercial temperature industrial controllers
- Portable electronic devices requiring non-volatile storage
Memory IC Procurement Notes
Verify the specific ordering suffix and package variant against official ATP Electronics documentation before procurement. Confirm that the commercial temperature rating aligns with your system's operational environment. Ensure compatibility with the host controller's eMMC 5.1 HS400 interface support. Cross-reference the 153-ball FBGA footprint with your PCB design specifications to guarantee mechanical fit.
Memory IC Selection Notes
Select this component when a 10GB capacity is required within a constrained 153-ball BGA footprint. It is suitable for applications operating between 2.7V and 3.6V where commercial temperature ranges are sufficient. Consider the HS400 interface speed if high sequential write performance is necessary for the target embedded application.
Memory IC Part Context
This part belongs to the ATP Electronics AF0xxGEC series of eMMC flash memories. The series offers various capacities within the same 153-ball FBGA form factor, allowing for scalable storage solutions across different product lines while maintaining pin compatibility and interface standards for embedded designs.
Memory IC Replacement Considerations
Direct substitutes must match the 153-ball FBGA package, 10GB capacity, and eMMC 5.1 HS400 interface. Verify voltage and temperature ratings. Consult ATP Electronics for qualified alternative part numbers within their portfolio.
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