AF010GEC5A-2004IX

Memory IC Overview

The AF010GEC5A-2004IX is a 10 Gbit eMMC flash memory device manufactured by ATP Electronics, Inc. It utilizes pSLC technology and is housed in an FBGA-153 package measuring 11.5x13 mm. The component supports the eMMC 5.1 HS400 interface with a supply voltage range of 2.7 V to 3.6 V for Vcc and 1.8 V/3.3 V for Vccq. It offers sequential read speeds up to 295 MB/s and write speeds up to 215 MB/s. The operating temperature range spans from -40 °C to 85 °C, ensuring reliability in industrial environments.

Memory IC Feature Summary

• Built-in error correction code (ECC) function
• Secure erase function

Memory IC Applications

• Industrial embedded systems
• Automotive electronics
• IoT devices requiring high durability

Memory IC Procurement Notes

Verify the specific suffix IX indicates the industrial temperature grade (-40°C to 85°C) and pSLC configuration as documented. Confirm the FBGA-153 package dimensions match your PCB footprint requirements. Ensure compatibility with eMMC 5.1 HS400 host controllers before integration. Cross-reference the manufacturer part number with official ATP Electronics documentation to avoid counterfeit components.

Memory IC Selection Notes

Select this component when high endurance and wide temperature operation are required. The pSLC mode provides superior data retention compared to sLC or mLC variants. The 10 Gbit capacity suits applications needing moderate storage density. Verify that the host system supports the 3.3V/1.8V dual-voltage logic levels specified for reliable communication.

Memory IC Part Context

This part belongs to ATP Electronics' industrial-grade eMMC family. It is designed for demanding environments where standard commercial parts fail. The FBGA-153 package allows for compact board designs. It complements other ATP memory solutions by offering robust data integrity features essential for critical infrastructure.

Memory IC Replacement Considerations

Check for compatible substitutes within the same ATP eMMC series. Ensure any replacement maintains the 153-ball BGA footprint and HS400 interface support. Verify that alternative parts meet the same -40°C to 85°C operating temperature range and pSLC endurance specifications.