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AF016GEC5A-2001A2 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 128GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF016GEC5A-2001A2
- Description：IC FLASH 128GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：128Gbit
- Memory Organization：16G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF016GEC5A-2001A2
Memory IC Overview
The AF016GEC5A-2001A2 is a 128 Gbit NAND Flash memory device organized as 16G x 8 bits, utilizing pSLC technology. It features an eMMC interface compliant with eMMC 5.1 HS400 standards. The component is housed in a 153-FBGA package measuring 11.5 mm x 13 mm x 1.3 mm. It operates within an extended temperature range of -40°C to +105°C and supports sequential write speeds up to 170 MB/s.
Memory IC Feature Summary
- Utilizes pSLC NAND technology for enhanced endurance and reliability
- Supports high-speed HS400 data transfer via eMMC 5.1 interface
- Designed for automotive-grade environmental stability
Memory IC Applications
- Automotive infotainment systems
- Advanced driver-assistance systems (ADAS)
- Vehicle telematics units
Memory IC Procurement Notes
Verify the specific suffix 'A2' against official ATP Electronics documentation to confirm pinout and electrical characteristics. Ensure the procurement channel provides traceability for automotive-grade components. Confirm moisture sensitivity level handling requirements prior to assembly.
Memory IC Selection Notes
Select this model when a 16GB capacity is required alongside strict automotive temperature ratings. The eMMC 5.1 HS400 interface is suitable for applications demanding high throughput. Compare against other members of the AF series for capacity scaling options while maintaining the same form factor.
Memory IC Part Context
This component belongs to the AF series of automotive-grade flash memory products from ATP Electronics. The series is designed to meet AEC-Q100 standards, ensuring robustness for harsh environments. The 153-BGA package allows for compact integration into space-constrained electronic control units.
Memory IC Replacement Considerations
The AF032GEC5X-2001A2 is a documented substitute offering 32 Gbit capacity in the same package. Verify compatibility if higher storage density is needed without changing the board layout.
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