AF016GEC5A-2001EX

Memory IC Overview

The AF016GEC5A-2001EX is a 128 Gbit (16 GB) NAND flash memory device utilizing pSLC technology and an eMMC interface. It is housed in a 153-FBGA package measuring 11.5 x 13 mm. The component supports eMMC 5.1 HS400 interface standards with sequential write speeds up to 240 MB/s. It operates within an extended industrial temperature range of -40°C to +105°C, ensuring reliability in demanding environments.

Memory IC Feature Summary

• Utilizes pSLC NAND technology for enhanced endurance and data retention compared to standard MLC options.
• Supports high-speed HS400 interface mode compliant with eMMC 5.1 specifications.
• Engineered for extended industrial temperature operation ranging from -40°C to +105°C.

Memory IC Applications

• Industrial control systems requiring robust storage under extreme temperatures
• Automotive embedded applications needing high reliability
• Consumer electronics demanding extended lifespan and stable performance

Memory IC Procurement Notes

Verify the specific suffix 'A' against official ATP Electronics documentation to confirm the exact temperature grade and pinout configuration. Ensure compatibility with host controllers supporting eMMC 5.1 HS400 modes. Confirm that the 153-BGA footprint matches your PCB design constraints. Request updated lifecycle status directly from the manufacturer or authorized distributors to avoid obsolete stock issues.

Memory IC Selection Notes

Select this model when application requirements demand extended industrial temperature tolerance (-40°C to +105°C) combined with high-speed data transfer capabilities. The pSLC technology offers superior endurance over standard MLC variants, making it suitable for write-intensive workloads. Ensure the host system supports the 153-FBGA package dimensions and eMMC 5.1 protocol for optimal integration.

Memory IC Part Context

This component belongs to ATP Electronics' AF series of embedded MultiMediaCard devices. These parts are designed for mobile and industrial markets, offering a balance of capacity, speed, and durability. The AF016GEC5A-2001EX specifically targets applications where standard commercial-grade components fail due to thermal stress or high write cycles.

Memory IC Replacement Considerations

Direct substitutes include other ATP Electronics eMMC parts within the same FBGA-153 form factor, such as the AF032GEC5X-2001EX for higher capacity needs. Verify that any replacement maintains the same pSLC technology and extended temperature rating to ensure functional equivalence in harsh environments.