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AF016GEC5X-2001A2 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 128GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF016GEC5X-2001A2
- Description：IC FLASH 128GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：128Gbit
- Memory Organization：16G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF016GEC5X-2001A2
Memory IC Overview
The AF016GEC5X-2001A2 is a 16 GB NAND flash memory component manufactured by ATP Electronics, Inc. It utilizes Multi-Level Cell (MLC) technology and adheres to the eMMC 5.1 standard with HS400 interface support. The device features a sequential write speed of 170 MB/s and operates within an extended temperature range from -40°C to +105°C. It is packaged in a 153-ball FBGA measuring 11.5 mm x 13 mm x 1.3 mm. The part holds AEC-Q100 qualification for automotive applications.
Memory IC Feature Summary
- Automotive-grade reliability certified under AEC-Q100 standards
- Supports high-speed HS400 interface via eMMC 5.1 protocol
- Operates reliably across extended industrial temperature ranges
Memory IC Applications
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
- Vehicle telematics control units
Memory IC Procurement Notes
Verify the specific suffix against official ATP Electronics documentation to confirm exact performance grades and qualification status. Ensure compatibility with host controller eMMC 5.1 implementations. Confirm moisture sensitivity level handling requirements during assembly. Validate that the 153-ball FBGA footprint matches the target PCB design constraints.
Memory IC Selection Notes
Select this component when automotive certification and wide temperature operation are mandatory. The eMMC 5.1 HS400 interface suits high-throughput data logging needs. MLC configuration offers a balance between endurance and cost for non-critical storage. Verify that the 16 GB capacity meets system firmware and user data requirements without excessive overhead.
Memory IC Part Context
This part belongs to ATP Electronics' automotive memory portfolio designed for harsh environments. It integrates NAND flash with a built-in controller to manage wear leveling and error correction. The FBGA package allows for compact integration into space-constrained electronic control units. It serves as a robust storage solution for modern vehicle electronics requiring high durability.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Cross-referencing requires direct consultation with ATP Electronics or authorized distributors to identify equivalent automotive-grade eMMC devices with matching pinouts and specifications.
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