AF016GEC5X-2001A3

Memory IC Overview

The AF016GEC5X-2001A3 is a 128 Gbit NAND Flash memory IC manufactured by ATP Electronics, Inc. It implements the eMMC (Embedded MultiMediaCard) interface protocol and utilizes 3D MLC (Multi-Level Cell) technology for data storage. The component is housed in a 153-ball BGA package with physical dimensions of 11.5mm x 13mm. It complies with the eMMC V5.1 standard and is qualified to AEC-Q100 Grade 3 standards, ensuring reliability for automotive applications. The device operates within an extended industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Complies with eMMC V5.1 standard for standardized embedded multimedia card communication
• Qualified to AEC-Q100 Grade 3 standards for automotive reliability requirements
• Operates within extended industrial temperature range from -40°C to +85°C
• Utilizes 3D MLC NAND flash technology for high-density data storage

Memory IC Applications

• Automotive infotainment systems requiring robust storage solutions
• Industrial control units operating in extreme temperature environments
• Embedded multimedia devices needing compliant eMMC interfaces
• Data acquisition systems in nuclear electronics and RPC detectors

Memory IC Procurement Notes

Verify the specific suffix '2001A3' against official ATP Electronics documentation to confirm exact binning, packaging, and qualification status. Ensure compatibility with host controllers supporting eMMC V5.1 protocols. Confirm that the 153-ball BGA footprint matches the target PCB design constraints. Request relevant datasheets and quality certificates directly from authorized distributors or the manufacturer to validate authenticity and traceability before procurement.

Memory IC Selection Notes

Select this component when a 128 Gbit capacity is required alongside strict automotive-grade reliability certifications. The AEC-Q100 Grade 3 qualification makes it suitable for harsh environments where other commercial-grade parts would fail. Consider the 153-ball BGA package size during mechanical design phases. Verify that the host system supports the electrical characteristics and command sets defined in the eMMC V5.1 specification to ensure proper integration and functionality.

Memory IC Part Context

This part belongs to the ATP Electronics AF016 series, which focuses on specialized storage solutions for industrial and automotive markets. ATP Electronics specializes in providing memory products tailored for demanding applications, including those found in nuclear electronics and data acquisition systems. The series emphasizes durability and compliance with stringent industry standards, distinguishing these components from general-purpose consumer memory devices.

Memory IC Replacement Considerations

Check for direct substitutes within the ATP AF016 series that may offer different capacities or package variations while maintaining the same interface and qualification standards. Verify pin-to-pin compatibility if replacing with similar eMMC devices from other manufacturers. Ensure any alternative part meets the same AEC-Q100 Grade 3 and temperature range requirements to maintain system integrity.