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AF021GEC5A-2004IX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 21GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF021GEC5A-2004IX
- Description：IC FLASH 21GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：-
- Memory Size：21GBIT
- Memory Organization：-
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF021GEC5A-2004IX
Memory IC Overview
The AF021GEC5A-2004IX is a 21GB embedded MultiMediaCard (eMMC) manufactured by ATP Electronics, Inc. It utilizes a 153-ball Ball Grid Array (BGA) package designed for industrial temperature applications. The component operates within a specified temperature range of -40°C to 85°C, ensuring reliability in demanding environments. As an eMMC device, it integrates NAND flash memory with a dedicated controller, providing a standardized interface for high-speed data storage and retrieval in compact electronic systems.
Memory IC Feature Summary
- Industrial-grade thermal stability for extreme environment operation
- Integrated controller and NAND flash in a single BGA package
- Standardized eMMC interface for simplified system integration
Memory IC Applications
- Industrial control systems requiring robust data logging
- Embedded devices operating in wide temperature ranges
- Compact consumer electronics needing reliable non-volatile storage
Memory IC Procurement Notes
Verify the specific suffix codes against official ATP documentation to confirm exact capacity, speed grade, and temperature rating. Ensure compatibility with host controllers supporting the eMMC standard. Confirm package integrity upon receipt, as BGA components require careful handling during assembly and inspection processes.
Memory IC Selection Notes
Select this component when a compact, high-reliability storage solution is required for industrial or embedded applications. The 153-ball BGA form factor suits space-constrained designs. Verify that the host system supports the eMMC protocol and can accommodate the physical dimensions and electrical requirements of the 21GB capacity module.
Memory IC Part Context
ATP Electronics specializes in memory solutions for industrial and embedded markets. This eMMC part belongs to their lineup of ruggedized storage products designed for longevity and performance under stress. The product series emphasizes durability and consistent operation across varying environmental conditions, distinguishing it from commercial-grade alternatives.
Memory IC Replacement Considerations
Consult ATP official substitution guides for compatible upgrades. Ensure any replacement maintains the 153-ball BGA footprint and eMMC interface compatibility. Verify that alternative parts meet the same industrial temperature specifications and capacity requirements.
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