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AF032GEC5A-2001A3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 256GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF032GEC5A-2001A3
- Description：IC FLASH 256GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF032GEC5A-2001A3
Memory IC Overview
The AF032GEC5A-2001A3 is a 256Gbit non-volatile NAND FLASH memory device organized as 32G x 8. It utilizes pseudo-Single Level Cell (pSLC) technology to provide enhanced endurance and reliability compared to standard multi-level cell options. The component is packaged in an FBGA-153 format, measuring 11.5x13mm. Designed for automotive applications, it supports advanced eMMC functionality with industrial temperature range capabilities.
Memory IC Feature Summary
- Utilizes pSLC technology for improved data retention and write endurance
- Optimized for high-reliability automotive embedded systems
- Compact FBGA-153 package suitable for space-constrained designs
Memory IC Applications
- Automotive infotainment systems
- Advanced driver-assistance systems (ADAS)
- Vehicle telematics units
Memory IC Procurement Notes
Verify current availability status as the manufacturer has scheduled this part for obsolescence. Confirm end-of-life dates and last-time-buy windows before finalizing procurement plans. Ensure compatibility with existing board layouts given the specific FBGA-153 footprint requirements.
Memory IC Selection Notes
Select this component when automotive-grade reliability and extended cycle endurance are critical. The pSLC architecture offers a balance between cost and performance for mission-critical storage needs. Evaluate thermal management requirements against the specified operating temperature range.
Memory IC Part Context
This part belongs to ATP Electronics' automotive-grade embedded flash memory portfolio. It is designed to meet stringent automotive industry standards for durability and consistent performance under varying environmental conditions. The series focuses on providing robust storage solutions for complex vehicle electronics.
Memory IC Replacement Considerations
Check for official substitute part numbers from ATP Electronics or Microchip. Verify pin-to-pin compatibility and electrical parameter alignment before considering alternative sources due to the scheduled obsolescence of this specific model.
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