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AF032GEC5A-2001EX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 256GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF032GEC5A-2001EX
- Description：IC FLASH 256GBIT EMMC 153BGA
- Series：Ex-Temp
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：256Gbit
- Memory Organization：32G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF032GEC5A-2001EX
Memory IC Overview
The AF032GEC5A-2001EX is a 32 GB embedded multimedia card (eMMC) manufactured by ATP Electronics, Inc. It features a memory organization of 32G x 8 and utilizes Single-Level Cell (SLC) NAND flash technology. The component operates within an extended industrial temperature range of -40°C to +105°C. It is housed in a 153-FBGA surface-mount package with dimensions of 11.5 mm x 13 mm x 1.3 mm.
Memory IC Feature Summary
- Supports eMMC interface for embedded storage applications
- Utilizes SLC NAND flash for enhanced data retention
- Rated for extended industrial operating temperatures
Memory IC Applications
- Industrial control systems
- Automotive electronics
- Embedded computing devices
Memory IC Procurement Notes
Verify the specific suffix EX against official ATP documentation to confirm the exact temperature grade and package variant. Ensure compatibility with the host controller's eMMC version support before integration. Confirm RoHS compliance status through current manufacturer declarations.
Memory IC Selection Notes
Select this component when high reliability and wide temperature tolerance are required for embedded storage. The SLC configuration offers superior endurance compared to MLC or TLC alternatives. Verify that the 153-pin FBGA footprint matches the target PCB design constraints.
Memory IC Part Context
This part belongs to ATP Electronics' embedded memory portfolio, designed for demanding environments. It serves as a non-volatile storage solution for systems requiring robust data integrity and consistent performance under thermal stress.
Memory IC Replacement Considerations
Consult ATP Electronics for verified cross-reference parts. Substitutions must match the 153-FBGA package, eMMC interface, and -40°C to +105°C temperature rating.
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