AF032GEC5X-2001A3

Memory IC Overview

The AF032GEC5X-2001A3 is a 256 Gbit eMMC module utilizing MLC NAND technology, designed for industrial applications. It features an eMMC 5.1 HS400 interface with a sequential write speed of 170 MB/s. The component measures 11.5 mm x 13 mm x 1.3 mm and operates within a temperature range of -40°C to +85°C. It employs SMD/SMT mounting and includes built-in wear leveling, ECC error correction, and power-down data protection.

Memory IC Feature Summary

• Built-in wear leveling function
• ECC error correction function
• Power-down data protection

Memory IC Applications

• Industrial embedded systems
• Automotive electronics
• Compact storage solutions requiring high reliability

Memory IC Procurement Notes

Verify the specific suffix A3 against official ATP Electronics documentation to confirm exact configuration and revision status. Ensure compatibility with host controllers supporting eMMC 5.1 HS400 standards. Confirm moisture sensitivity handling procedures are followed during assembly due to the component's classification as moisture sensitive.

Memory IC Selection Notes

Select this module when a compact form factor is required alongside robust industrial temperature tolerance. The inclusion of hardware-level error correction and wear leveling makes it suitable for environments demanding long-term data integrity without complex software management overhead.

Memory IC Part Context

This part belongs to the ATP Electronics embedded memory portfolio, specifically targeting ruggedized applications. It integrates flash memory and controller functions into a single BGA package, simplifying PCB layout compared to discrete NAND solutions while maintaining automotive-grade durability standards.

Memory IC Replacement Considerations

Consult official ATP Electronics substitution guides for verified alternatives. Cross-referencing with generic eMMC components may result in functional mismatches regarding interface timing or firmware behavior.