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AF032GEC5X-2004IX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 32GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF032GEC5X-2004IX
- Description：IC FLASH 32GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：-
- Memory Size：32Gbit
- Memory Organization：-
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF032GEC5X-2004IX
Memory IC Overview
The ATP Electronics AF032GEC5X-2004IX is a 32 GB embedded multimedia card (eMMC) memory IC. It utilizes 3D TLC NAND flash technology and features an FBGA-153 package with dimensions of 11.5x13 mm. The device supports the eMMC 5.1 specification with HS400 interface mode. Operating voltage ranges from 2.7 V to 3.6 V, and it functions within a temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports eMMC 5.1 standard with HS400 high-speed interface for enhanced data throughput.
- Utilizes 3D TLC NAND flash architecture for dense storage integration.
- Designed for industrial-grade operation across extended temperature ranges.
Memory IC Applications
- Industrial control systems requiring reliable embedded storage
- Automotive infotainment and telematics modules
- Embedded computing platforms in harsh environments
Memory IC Procurement Notes
Verify component authenticity through authorized ATP Electronics distributors or SemiKey. Confirm package integrity and pin alignment upon receipt. Ensure compatibility with host controller eMMC 5.1 HS400 support. Check for RoHS3 compliance documentation. Validate operating temperature ratings against system thermal design specifications before integration.
Memory IC Selection Notes
Select this component when 32 GB capacity meets system requirements alongside 3D TLC cost-performance balance. Verify host interface supports eMMC 5.1 HS400 signaling speeds. Ensure mechanical clearance accommodates the 11.5x13 mm FBGA-153 footprint. Confirm power supply stability within 2.7V–3.6V range. Evaluate thermal management capabilities for -40°C to 85°C operational envelope.
Memory IC Part Context
This part belongs to ATP Electronics' embedded memory portfolio, specifically designed for demanding applications. It complements other eMMC variants like the AF032GEC5A series. The device addresses market needs for compact, high-density storage solutions in industrial and automotive sectors where reliability and wide temperature tolerance are critical.
Memory IC Replacement Considerations
No publicly confirmed substitute part numbers are available for direct replacement. Consider reviewing ATP's current eMMC lineup for equivalent capacity and interface specifications. Verify pin-to-pin compatibility and electrical characteristics before substituting any alternative components.
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