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AF064GEC5A-2001A2 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5A-2001A2
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF064GEC5A-2001A2
Memory IC Overview
The AF064GEC5A-2001A2 is a 512 Gbit eMMC NAND flash memory IC manufactured by ATP Electronics, Inc. It utilizes 3D MLC technology with pSLC mode for enhanced reliability and endurance. The component operates within an extended industrial temperature range of -40°C to +105°C and holds AEC-Q100 Grade 2 qualification for automotive applications. It features a 153-ball BGA package measuring 11.5 mm x 13 mm x 1.3 mm. Sustained read speeds reach up to 300 MB/s.
Memory IC Feature Summary
- Automotive-grade reliability certified under AEC-Q100 standards
- Industrial temperature operation spanning -40°C to +105°C
- 3D MLC NAND architecture configured in pSLC mode
- Compact 153-ball BGA surface-mount packaging
Memory IC Applications
- Automotive infotainment systems
- Advanced driver assistance systems (ADAS)
- Industrial embedded controllers
- Automotive telematics units
Memory IC Procurement Notes
Verify the specific suffix against official ATP documentation to confirm exact thermal and qualification grades. Confirm package dimensions and pinout compatibility during integration. Request current datasheets directly from the manufacturer or authorized distributors to ensure accuracy. Validate AEC-Q100 certification status for target automotive environments before final selection.
Memory IC Selection Notes
Select this component for designs requiring high endurance in harsh thermal environments. The pSLC configuration on 3D MLC provides superior write performance compared to standard MLC. Ensure the host controller supports the eMMC interface version specified in the datasheet. Verify that the 153-BGA footprint matches the PCB layout constraints.
Memory IC Part Context
This part belongs to ATP Electronics' automotive-grade embedded multimedia card series. It is designed specifically for demanding vehicular electronics where data integrity and wide temperature tolerance are critical. The product line emphasizes long-term availability and robustness for safety-critical and convenience applications in modern vehicles.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult ATP Electronics technical support for qualified alternatives or cross-reference options based on specific electrical and mechanical requirements.
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