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AF064GEC5A-2001A3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5A-2001A3
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF064GEC5A-2001A3
Memory IC Overview
The AF064GEC5A-2001A3 is a NAND flash memory IC manufactured by ATP Electronics, Inc. It utilizes Multi-Level Cell (MLC) technology with a total capacity of 512 Gbit. The device integrates an embedded Multimedia Card (eMMC) interface and is housed in a 153-ball Ball Grid Array (BGA) package measuring 11.5 mm x 13 mm x 1.3 mm. It operates within an industrial temperature range of -40°C to +85°C.
Memory IC Feature Summary
- Industrial-grade reliability for demanding environments
- Embedded Multimedia Card (eMMC) interface integration
- Multi-Level Cell (MLC) NAND flash architecture
Memory IC Applications
- Industrial computing systems
- Embedded multimedia devices
- Automotive electronics requiring wide temperature tolerance
Memory IC Procurement Notes
Verify the specific suffix 'A3' against official ATP documentation to confirm exact revision or binning specifications. Ensure compatibility with host controllers supporting standard eMMC protocols. Confirm that the 153-BGA footprint matches the target PCB design constraints. Cross-reference the operating temperature range with system thermal management capabilities.
Memory IC Selection Notes
Select this component when high-density storage is required in space-constrained industrial applications. The MLC technology offers a balance between cost and endurance suitable for general-purpose embedded logging. The BGA package facilitates compact board layouts. Verify that the host system supports the specific voltage levels and command sets defined for this eMMC variant.
Memory IC Part Context
This part belongs to the AF064 series from ATP Electronics, focusing on embedded flash solutions. The series targets markets requiring robust data retention and performance under extreme conditions. ATP specializes in memory products tailored for industrial and automotive sectors, ensuring long-term availability and stability compared to consumer-grade alternatives.
Memory IC Replacement Considerations
Check for direct substitutes within the AF064 family, such as AF064GEC5A-2001A2, noting that suffix changes may indicate different revisions or packaging variations rather than functional differences. Consult ATP for qualified alternate part numbers if this specific SKU is unavailable.
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