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AF064GEC5A-2001EX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5A-2001EX
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：Ex-Temp
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 105°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF064GEC5A-2001EX
Memory IC Overview
The AF064GEC5A-2001EX is a 512 Gbit eMMC flash memory component manufactured by ATP Electronics, Inc. It utilizes pSLC NAND technology and features a 64G x 8 memory organization within a 153-ball FBGA package measuring 11.5 mm x 13 mm x 1.3 mm. The device supports surface mount mounting and operates reliably across an extended industrial temperature range from -40°C to +105°C.
Memory IC Feature Summary
- Enhanced eMMC solution designed for industrial and automotive environments
- Utilizes pSLC NAND technology for reliable data storage
- Qualified under AEC-Q100 standards for automotive applications
Memory IC Applications
- Automotive embedded systems
- Industrial control units
- Embedded computing devices requiring extended temperature tolerance
Memory IC Procurement Notes
Verify the specific suffix EX confirms the -40°C to +105°C operating range, as other variants like A3 may differ. Confirm AEC-Q100 qualification status if automotive compliance is required. Ensure the 153-ball FBGA footprint matches the target PCB design. Cross-reference the manufacturer part number with official ATP Electronics documentation to avoid confusion with similar model numbers.
Memory IC Selection Notes
Select this component when high reliability in extreme temperatures is critical. The pSLC technology offers endurance advantages over standard SLC or MLC in harsh conditions. The eMMC interface simplifies integration compared to raw NAND solutions. Consider the physical dimensions and ball count for board space constraints.
Memory IC Part Context
This part belongs to the AF064 series of eMMC flash memories from ATP Electronics. It is distinct from the AF064GEC5A-2001A3, which typically has a lower maximum operating temperature of +85°C. The EX suffix specifically denotes the extended industrial temperature capability suitable for demanding environments.
Memory IC Replacement Considerations
The AF064GEC5A-2001A3 is a related variant but differs in operating temperature limits. Verify thermal requirements before substitution. No direct cross-model substitutes are confirmed in public data without detailed electrical matching.
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