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AF064GEC5A-2001IX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5A-2001IX
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：Industrial
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF064GEC5A-2001IX
Memory IC Overview
The AF064GEC5A-2001IX is a 64 GB embedded multimedia card (eMMC) manufactured by ATP Electronics, Inc. It utilizes a TFBGA-153 package and supports the eMMC 5.1 interface standard. The device operates within a voltage range of 1.7 V to 3.6 V and functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed data transfer via the eMMC 5.1 HS400 interface standard for efficient command processing.
- Designed for robust operation in demanding environments with extended industrial temperature ratings.
- Utilizes a compact Thin Fine-pitch Ball Grid Array (TFBGA) form factor suitable for space-constrained applications.
Memory IC Applications
- Industrial automation systems requiring reliable non-volatile storage
- Embedded computing platforms operating in extreme temperatures
- Automotive infotainment and telematics units
Memory IC Procurement Notes
Verify the specific ordering suffix against official ATP Electronics documentation to confirm exact configuration details. Ensure compatibility with host controller interfaces supporting eMMC 5.1 standards before procurement. Confirm that the selected component meets all required environmental and electrical specifications for the intended deployment environment.
Memory IC Selection Notes
Select this component when a 64 GB capacity is required alongside support for the HS400 high-speed mode. Consider the TFBGA-153 package dimensions for PCB layout constraints. Verify that the host system can accommodate the specified 1.7 V to 3.6 V supply range and operate effectively within the -40°C to +85°C temperature window.
Memory IC Part Context
This part belongs to the ATP Electronics embedded storage portfolio, specifically designed for industrial and commercial embedded applications. It integrates flash memory and a controller into a single package, simplifying board design compared to discrete solutions. The eMMC 5.1 specification ensures standardized communication protocols for widespread compatibility.
Memory IC Replacement Considerations
Consult official ATP Electronics substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully when considering components from other manufacturers to ensure functional equivalence.
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