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AF064GEC5X-2001A3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5X-2001A3
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF064GEC5X-2001A3
Memory IC Overview
The AF064GEC5X-2001A3 is a NAND Flash memory IC manufactured by ATP Electronics, Inc. It utilizes Multi-Level Cell (MLC) technology and integrates the Enhanced Multimedia Card (eMMC) interface protocol. The device offers a storage capacity of 512 Gbit. It is housed in a 153-ball Ball Grid Array (BGA) package with physical dimensions of 11.5mm x 13mm. This component is designed for embedded applications requiring reliable data storage within a compact form factor.
Memory IC Feature Summary
- Integrates built-in wear leveling functions to extend flash memory lifespan
- Includes Error Correction Code (ECC) capabilities for data integrity
- Provides power-down data protection mechanisms
Memory IC Applications
- Embedded multimedia card systems
- Industrial control units
- Automotive infotainment modules
Memory IC Procurement Notes
Verify the specific suffix codes against official ATP Electronics documentation to confirm exact specifications. Ensure compatibility with host controllers supporting the eMMC standard. Confirm package dimensions match the target PCB layout requirements before finalizing procurement decisions.
Memory IC Selection Notes
Select this component when a compact BGA footprint is required for high-density embedded storage. Consider the MLC technology characteristics regarding endurance and speed relative to SLC alternatives. Validate that the 153-ball BGA package fits within the mechanical constraints of the design.
Memory IC Part Context
This part belongs to the ATP Electronics AF series of embedded flash memory solutions. It is distinct from SSD modules like the AF120GSTIA-7BAIP, which utilize SATA interfaces and M.2 form factors. The AF064GEC5X-2001A3 is specifically an integrated circuit rather than a standalone drive module.
Memory IC Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided source material. Consult manufacturer documentation for direct replacements or compatible upgrades.
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