AF064GEC5X-2001EX

Memory IC Overview

The AF064GEC5X-2001EX is a 64 GB embedded multimedia card (eMMC) manufactured by ATP Electronics, Inc. It utilizes Multi-Level Cell (MLC) NAND flash technology and supports the eMMC 5.1 specification with HS400 interface mode. The component is housed in an FBGA-153 package measuring 11.5 x 13 mm. It operates within an extended industrial temperature range of -40°C to +105°C.

Memory IC Feature Summary

• Supports eMMC 5.1 standard with HS400 high-speed interface for enhanced data throughput.
• Incorporates built-in wear leveling and ECC error correction functions to ensure data integrity.
• Features power-down data protection mechanisms to safeguard stored information during unexpected power loss.

Memory IC Applications

• Industrial control systems requiring extended temperature stability
• Embedded storage solutions for IoT devices
• Automotive infotainment and telematics units

Memory IC Procurement Notes

Verify the specific suffix EX confirms the extended industrial temperature rating (-40°C to +105°C) and MLC NAND composition. Confirm the FBGA-153 package dimensions match the design footprint. Ensure compatibility with the host controller's eMMC 5.1 HS400 support before integration.

Memory IC Selection Notes

Select this component when long-term data retention and reliability are critical in harsh environments. The MLC technology offers a balance between endurance and cost compared to SLC options. Verify that the host system supports the required voltage levels and command sets defined in the eMMC 5.1 specification.

Memory IC Part Context

This part belongs to ATP Electronics' Ex-Temp series, designed for demanding applications beyond standard commercial limits. It serves as a non-volatile memory solution for embedded systems where space constraints and thermal resilience are primary design drivers.

Memory IC Replacement Considerations

Direct substitutes include other ATP eMMC parts with identical pinouts and capacity, such as the AF064GEC5X-2001A2 or A3 variants, provided the temperature and interface requirements align. Cross-manufacturer replacements require careful verification of electrical characteristics and firmware compatibility.