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AF064GEC5X-2001IX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 512GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5X-2001IX
- Description：IC FLASH 512GBIT EMMC 153BGA
- Series：Industrial
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (pSLC)
- Memory Size：512Gbit
- Memory Organization：64G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF064GEC5X-2001IX
Memory IC Overview
The AF064GEC5X-2001IX is an industrial-grade embedded MultiMediaCard (eMMC) device manufactured by ATP Electronics, Inc. It utilizes 3D Multi-Level Cell (MLC) NAND flash technology to provide a total storage capacity of 512 Gbit, organized as 64 Gbit x 8. The component operates within an extended industrial temperature range of -40°C to +85°C. It is housed in a compact BGA package with dimensions of 11.5mm x 13mm and features a 153-ball interface.
Memory IC Feature Summary
- Industrial-grade reliability designed for harsh operating environments
- Utilizes 3D MLC NAND flash architecture for enhanced density
- Extended temperature operation from -40°C to +85°C
Memory IC Applications
- Industrial automation controllers
- Embedded computing systems
- Ruggedized mobile devices
Memory IC Procurement Notes
Verify the specific suffix code against official ATP Electronics documentation to confirm exact configuration, as variations exist within the family. Confirm current lifecycle status, as this part may be obsolete or subject to last-time buy restrictions. Ensure compatibility with host controller eMMC specifications before procurement.
Memory IC Selection Notes
Select this component when high-density non-volatile storage is required for industrial applications. The 3D MLC technology offers a balance between endurance and cost. Verify that the host system supports the eMMC standard and can accommodate the 153-ball BGA footprint. Consider thermal management requirements given the industrial temperature rating.
Memory IC Part Context
This part belongs to the ATP Electronics AF064GEC5X series of embedded flash memory solutions. The series is engineered for demanding sectors requiring robust data retention and wide temperature tolerance. The 'IX' suffix typically denotes specific packaging and temperature grade configurations within the product line.
Memory IC Replacement Considerations
Direct substitutes are not explicitly confirmed in public sources. Evaluate other ATP Electronics eMMC variants with matching capacity and package dimensions. Cross-reference pinouts and electrical characteristics carefully before considering alternative manufacturers.
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