AF064GEC5X-2004CX

$17.21

Description：IC FLASH 64GBIT EMMC 153BGA
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray

SKU:4a7fae7ce060 Category: Memory IC Brand: ATP Electronics, Inc.

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Product introduction

AF064GEC5X-2004CX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 64GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AF064GEC5X-2004CX

Description：IC FLASH 64GBIT EMMC 153BGA
Series：-
Mfr：ATP Electronics, Inc.
Package：Tray
Memory Type：-
Memory Format：FLASH
Technology：-
Memory Size：64Gbit
Memory Organization：-
Memory Interface：eMMC
Clock Frequency：-
Write Cycle Time - Word, Page：-
Voltage - Supply：-
Operating Temperature：-
Mounting Type：-
Package / Case：-
Supplier Device Package：153-BGA (11.5x13)
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for AF064GEC5X-2004CX

AF064GEC5X-2004CX

Memory IC Overview

The AF064GEC5X-2004CX is a 64GB embedded multimedia card (eMMC) manufactured by ATP Electronics, Inc. It utilizes 3D TLC NAND flash memory and supports the eMMC 5.1 interface with HS400 mode. The component features sequential read speeds of 270MB/s and write speeds of 215MB/s. It is housed in a BGA package with 153 balls, measuring 11.5mm x 13mm. The device operates within an extended commercial temperature range.

Memory IC Feature Summary

Supports eMMC 5.1 standard with HS400 high-speed interface for efficient data transfer.
Utilizes 3D TLC NAND flash technology to provide reliable storage density.
Designed for surface-mount mounting via a compact 153-ball BGA footprint.

Memory IC Applications

Embedded systems requiring compact non-volatile storage
Industrial control units operating in extended temperature environments
Portable electronic devices utilizing eMMC interfaces

Memory IC Procurement Notes

Verify the specific suffix and revision level against official ATP documentation to ensure compatibility with target system requirements. Confirm that the 153-ball BGA package dimensions align with the PCB layout constraints. Check for any recent product change notifications or end-of-life announcements from the manufacturer before finalizing procurement plans.

Memory IC Selection Notes

Select this component when a compact form factor is required alongside moderate performance levels suitable for embedded applications. The 64GB capacity balances storage needs with physical size constraints. Ensure the host controller supports eMMC 5.1 HS400 modes to utilize the specified throughput capabilities effectively.

Memory IC Part Context

This part belongs to ATP Electronics' embedded memory portfolio, which focuses on industrial-grade components. The AF series typically targets ruggedized and specialized computing environments where reliability and thermal stability are critical. This specific model integrates flash memory directly into the package for space-constrained designs.

Memory IC Replacement Considerations

Consult ATP's cross-reference tools for parametrically similar parts. Verify pin compatibility and electrical specifications before substituting with other manufacturers' eMMC solutions.