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AF064GEC5X-2004IX is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 64GBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF064GEC5X-2004IX
- Description：IC FLASH 64GBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：-
- Memory Size：64Gbit
- Memory Organization：-
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for AF064GEC5X-2004IX
Memory IC Overview
The AF064GEC5X-2004IX is a 64GB e.MMC flash memory component manufactured by ATP Electronics, Inc. It utilizes a 153-ball BGA package and offers industrial temperature operation ranging from -40°C to +85°C. This device is designed for embedded storage applications requiring reliable data retention in demanding environments.
Memory IC Feature Summary
- Industrial-grade operating temperature range suitable for harsh environments
- Embedded Multi-Media Card (e.MMC) interface for compact integration
- High-density 64GB NAND flash storage capacity
Memory IC Applications
- Industrial control systems
- Automotive infotainment units
- Medical devices
- Ruggedized portable electronics
Memory IC Procurement Notes
Verify the specific suffix and package variant against official ATP datasheets before procurement. Confirm that the 153-ball BGA footprint matches the target PCB design. Ensure the industrial temperature rating aligns with system thermal requirements. Check for any recent product change notifications or end-of-life announcements directly from the manufacturer.
Memory IC Selection Notes
Select this component when an embedded solution with high density and wide temperature tolerance is required. The 153-ball BGA form factor supports space-constrained designs. Compare performance metrics against standard commercial-grade alternatives if environmental conditions are less severe. Ensure controller compatibility with e.MMC protocols.
Memory IC Part Context
This part belongs to ATP Electronics' embedded memory portfolio, focusing on industrial and automotive reliability. The AF series typically denotes specific form factors and interfaces within their broader NAND flash lineup. It serves as a drop-in replacement for other 153-ball e.MMC components in existing designs.
Memory IC Replacement Considerations
Consult ATP's official substitution guide for verified equivalents. Verify pin-to-pin compatibility for the 153-ball BGA package. Ensure the replacement maintains the -40°C to +85°C operating range. Cross-reference electrical specifications to guarantee functional parity.
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