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AF128GEC5X-2001A3 is listed in the Memory IC range at ChipApex. The manufacturer field lists ATP Electronics, Inc.. Its product description is IC FLASH 1TBIT EMMC 153BGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for AF128GEC5X-2001A3
- Description：IC FLASH 1TBIT EMMC 153BGA
- Series：-
- Mfr：ATP Electronics, Inc.
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NAND (MLC)
- Memory Size：1Tbit
- Memory Organization：128G x 8
- Memory Interface：eMMC
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：153-FBGA
- Supplier Device Package：153-BGA (11.5x13)
- Access Time：-
- Grade：Automotive
- Qualification：-
Memory IC datasheet and documents for AF128GEC5X-2001A3
Memory IC Overview
The AF128GEC5X-2001A3 is a 128 GB eMMC flash memory component manufactured by ATP Electronics. It utilizes 3D MLC NAND technology and operates within an extended temperature range of -40°C to +85°C. The device meets AEC-Q100 Grade 3 automotive reliability standards. Physical dimensions are 11.5 mm x 13 mm x 1.3 mm in an FBGA-153 package.
Memory IC Feature Summary
- Complies with AEC-Q100 Grade 3 automotive qualification standards for high reliability
- Utilizes 3D Multi-Level Cell (MLC) NAND flash technology
- Supports extended industrial operating temperatures from -40°C to +85°C
Memory IC Applications
- Automotive infotainment systems
- Industrial control units
- Embedded storage solutions requiring automotive-grade reliability
Memory IC Procurement Notes
Verify the specific manufacturer datasheet for detailed electrical characteristics and pin configurations. Confirm that the AEC-Q100 Grade 3 certification aligns with your system's environmental requirements. Ensure compatibility with the host controller's eMMC interface version before integration into the design.
Memory IC Selection Notes
Select this component when automotive-grade durability and wide temperature tolerance are required. The 128 GB capacity suits applications needing substantial embedded storage. The FBGA-153 package offers a compact footprint suitable for space-constrained electronic assemblies.
Memory IC Part Context
ATP Electronics specializes in specialized storage and memory solutions for rigorous environments. This part belongs to their automotive-grade eMMC portfolio, designed to meet the stringent demands of transportation and industrial sectors where standard commercial components may fail.
Memory IC Replacement Considerations
Consult official ATP documentation for verified cross-reference part numbers. Do not assume functional equivalence with other manufacturers' eMMC devices without verifying interface timing and command set compatibility.
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