AF128GEC5X-2001EX

Memory IC Overview

The AF128GEC5X-2001EX is a 128Gb (16GB) eMMC memory device manufactured by ATP Electronics. It utilizes a 153-FBGA surface-mount package with dimensions of 11.5mm x 13mm. The component employs 3D MLC NAND technology and supports the Extended Industrial temperature range of -40°C to +105°C.

Memory IC Feature Summary

• Supports eMMC interface protocol for embedded multimedia card applications
• Utilizes 3D Multi-Level Cell (MLC) NAND flash architecture
• Rated for extended industrial operating temperatures from -40°C to +105°C

Memory IC Applications

• Industrial embedded storage systems
• Automotive infotainment units
• Ruggedized mobile computing devices

Memory IC Procurement Notes

Verify the specific suffix 'EX' corresponds to the extended industrial temperature grade (-40°C to +105°C) as defined in the official ATP datasheet. Confirm that the 153-FBGA footprint matches the target PCB design. Ensure compatibility with the host controller's eMMC version support before integration.

Memory IC Selection Notes

Select this component when high-density storage is required within strict physical size constraints of an 11.5x13mm BGA package. The choice is driven by the need for reliable data retention in harsh thermal environments, specifically where standard commercial grade parts cannot maintain functionality above 85°C or below 0°C.

Memory IC Part Context

This part belongs to ATP Electronics' specialized storage portfolio, targeting industrial and automotive sectors. It represents a high-capacity solution within their eMMC lineup, designed to replace older generation storage modules in compact embedded designs requiring robust performance under extreme conditions.

Memory IC Replacement Considerations

Check for direct substitutes such as the AF128GEC5X-2001A2 or AF128GEC5X-2001IX if availability varies, ensuring the temperature grade and package type remain identical. Verify pinout compatibility with existing board layouts.