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AFDI002120104R7M01 is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Pulse Electronics. Its product description is INDUCTOR CHOKE. Review the specifications below when checking this part for your BOM.
The AFDI002120104R7M01 is a leaded power inductor manufactured by Pulse Electronics, belonging to the Chilisin Power product line. It is classified as a dip molding choke designed for ultra-high current applications. The component features a metal core and a shielded protection style. Key electrical specifications include an inductance of 4.7 uH with a tolerance of 20%. The device supports a maximum DC current of 3.5 A and has a saturation current of 3.5 A. Its maximum DC resistance is specified at 165 mOhms. The unit operates within a temperature range of -40 C to +125 C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct tolerance and packaging configuration. Confirm that the leaded package type aligns with the target PCB assembly process requirements. Cross-reference the AEC-Q200 qualification status if automotive reliability standards are mandatory for the end application. Ensure the ultra-high current rating matches the thermal management design of the final system.
Select this component when high current capacity is critical for the power stage design. The dip molding technology offers superior durability compared to standard wound components. Evaluate the 165 mOhms DC resistance to calculate conduction losses accurately. Consider the physical dimensions and lead spacing for mechanical fitment on the printed circuit board layout.
This part belongs to the Chilisin Power series produced under license or partnership with Pulse Electronics. It serves as a specialized solution for power chokes requiring high current density. The product line focuses on providing reliable shielding and thermal performance for compact power electronics designs.
Direct substitutes must match the 4.7 uH inductance, 3.5 A current rating, and leaded dip molding form factor. Verify equivalent shielding effectiveness and core material properties to maintain circuit stability.
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