AFS090-2FG256I

Overview

The AFS090-2FG256I is a Fusion mixed-signal Field Programmable Gate Array (FPGA) manufactured by Microsemi Corporation. It features 90,000 system gates and 2,304 VersaTiles. The device utilizes an advanced 130-nm, 7-layer metal flash-based CMOS process. It includes 2 Mbits of embedded user flash memory and 1 Kbit of FlashROM. The integrated analog subsystem comprises one Analog Quad with up to 15 ADC input channels and 5 gate driver outputs. The part operates within an industrial temperature range of -40°C to +100°C and is housed in a 256-pin Fine Pitch Ball Grid Array (FG256) package.

Feature Summary

• Instant On nonvolatile flash technology eliminates the need for external configuration boot PROMs.
• Integrated analog peripherals include a high-resolution ADC and MOSFET gate drivers for mixed-signal applications.
• Advanced security features provide AES decryption and FlashLock protection for intellectual property.

Applications

• Power management systems
• Smart battery charging controllers
• Clock generation and management circuits

Procurement Notes

Verify that the specific ordering suffix matches the required speed grade (-2), package type (FG256), and industrial temperature rating (I). Confirm RoHS compliance status as standard packages may differ from green packaging options. Ensure the design includes the necessary license if cryptography IP implementation is required.

Selection Notes

Select this model when a low-density FPGA solution requires integrated analog capabilities and secure instant-on operation. Compare against higher-density Fusion devices like the AFS250 or AFS600 if additional logic resources or I/O banks are needed. Verify that the FG256 package dimensions fit the target PCB layout constraints.

Part Context

This component belongs to the Microsemi Fusion family of mixed-signal FPGAs. It shares architectural similarities with other Fusion devices but offers lower logic density. It is designed to replace discrete analog components and complex ASIC solutions in cost-sensitive and space-constrained environments.

Replacement Considerations

Direct pin-compatible replacements within the same package exist among other Fusion devices such as the AFS090-1FG256I or AFS090-2FG256. Higher density alternatives like the AFS250 series require schematic and layout modifications due to different I/O counts and resource availability.

FAQ

What is the maximum operating junction temperature for the AFS090-2FG256I?

The device supports an industrial temperature range with a maximum junction temperature of +100°C.

Does the AFS090-2FG256I require an external configuration device?

No, it uses Instant On flash technology, allowing it to operate directly upon power-up without external boot PROMs.

How many Analog Quads are included in the AFS090 device?

The AFS090 contains five Analog Quads, providing a total of 15 scalable analog input channels and 5 gate driver outputs.