ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC FPGA 119 I/O 256FBGA
- Series：Fusion®
- Mfr：Microchip Technology
- Package：Tray
- Number of LABs/CLBs：-
- Number of Logic Elements/Cells：-
- Total RAM Bits：276480
- Number of I/O：119
- Voltage - Supply：1.425V ~ 1.575V
- Mounting Type：Surface Mount
- Operating Temperature：0°C ~ 85°C (TJ)
- Package / Case：256-LBGA
- Supplier Device Package：256-FPBGA (17x17)
- Number of Gates：1500000
Download product information
Overview
The M1AFS1500-1FG256 is a Fusion FPGA IC featuring 1,500,000 system gates and 38,400 configurable logic blocks. It provides 119 I/Os within a 256-LBGA package measuring 17x17 mm. The device operates on a supply voltage ranging from 1.425V to 1.575V. Total embedded RAM capacity is 276,480 bits. The component supports an operating temperature range of 0°C to 85°C TJ. It utilizes a 130-nm flash-based CMOS process with a 1mm ball pitch.
Feature Summary
- Nonvolatile Flash technology enabling live at power-up functionality without external configuration memory
- Integrated ARM Cortex-M1 processor support for mixed-signal system integration
- In-system programming capability via JTAG with AES security features
Applications
- Industrial control systems requiring reprogrammable logic
- Mixed-signal signal processing applications
- Secure embedded controller implementations
Procurement Notes
Verify the specific suffix against official Microchip documentation to confirm temperature grade and package variant. Confirm RoHS compliance status as historical data indicates non-compliance for some variants. Check current PCN notices for assembly site or software updates before procurement.
Selection Notes
Select this model when high gate density and low-power flash technology are required. Ensure the design accommodates the 1.5V core voltage requirements. Verify that the 256-pin FBGA footprint matches the PCB layout constraints. Consider thermal management for the 0°C to 85°C industrial range operation.
Part Context
This part belongs to the Microchip Fusion family, bridging Actel's legacy flash FPGA technology with modern mixed-signal capabilities. It succeeds earlier AFS series devices while offering enhanced logic density compared to ProASIC3L counterparts in similar packages.
Replacement Considerations
Direct substitutes include M1AFS1500-FG256 for commercial temperature grades. Cross-family migration may involve U1AFS1500 variants for extended temperature ranges, though pinouts and toolchains require verification.
