AFS1500-1FGG256K

AFS1500-1FGG256K

$1,478.10
  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®

SKU:2c987475cb9e Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 119 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:276480
  • Number of I/O:119
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-55°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:1500000

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AFS1500-1FGG256K

Overview

The AFS1500-1FGG256K is a Fusion field-programmable gate array manufactured by Microchip Technology. It features 1.5 million system gates and 38,400 configurable logic blocks within a 256-pin fine-pitch ball grid array package. The device operates on a single 1.5 V supply voltage with a range of 1.425 V to 1.575 V. It supports a maximum operating frequency of 700 MHz and functions within an industrial temperature range of -40°C to +85°C. The component includes integrated non-volatile flash memory for configuration storage.

Feature Summary

  • Integrates high-density 1.5 million system gates with 38,400 configurable logic blocks for complex digital designs.
  • Features embedded non-volatile flash memory enabling instant-on operation without external configuration devices.
  • Supports mixed-voltage I/O standards including LVCMOS, LVTTL, LVDS, and HSTL across multiple banks.

Applications

  • Industrial automation control systems requiring deterministic logic processing.
  • Telecommunications infrastructure equipment utilizing high-speed serial interfaces.
  • Automotive electronic control units demanding robust FPGA performance in harsh environments.

Procurement Notes

Verify the specific suffix 'K' against official Microchip documentation to confirm package variant or quality grade distinctions. Ensure compatibility with existing PCB footprints for the FBGA-256 form factor. Confirm moisture sensitivity level requirements for assembly processes. Validate that the 1.5 V core voltage aligns with the target power delivery network design constraints.

Selection Notes

Select this model when high logic density is required alongside built-in non-volatile configuration capabilities. Compare against the M1AFS1500 series if embedded ARM Cortex-M1 processor support is necessary instead of pure logic resources. Evaluate pin count availability as the 256-pin package limits I/O expansion compared to larger footprint options.

Part Context

This component belongs to the Microchip Fusion family, which combines SRAM-based FPGA flexibility with Flash memory permanence. It succeeds earlier ProASIC3 Flash technologies by offering higher gate densities and improved I/O speeds. The AFS1500 variant represents a mid-range capacity solution within the broader Fusion portfolio designed for cost-sensitive high-volume applications.

Replacement Considerations

Direct pin-compatible alternatives within the same package include other members of the AFS1500 family with different speed grades or temperature ranges. Cross-family migration to the PolarFire or Igloo2 series requires schematic and layout redesign due to architectural differences.

AFS1500-1FGG256KAFS1500-1FGG256K
$1,478.10
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