SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AFS1500-FG256K is a Fusion field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 1,500,000 system gates and 38,400 configurable logic blocks (CLBs). The device operates within a supply voltage range of 1.42 V to 1.58 V, with a nominal rating of 1.5 V. It supports an industrial operating temperature range from -40°C to +85°C. The component is housed in a 256-ball fine-pitch ball grid array (FPBGA) package with a 1 mm pitch. This non-volatile flash-based FPGA retains configuration data when powered off.
Verify the specific suffix 'K' against official Microchip documentation to confirm if it denotes a specific packaging variant or quality grade, as standard datasheets may list the base model AFS1500-FG256. Confirm RoHS compliance status and moisture sensitivity level (MSL) prior to assembly planning. Ensure the source document explicitly identifies the manufacturer as Microchip Technology, noting that historical Actel products are now part of the Microchip portfolio.
Select this component when a design requires a high-density FPGA with integrated processing capabilities and non-volatile configuration storage. The 256-pin FBGA package is suitable for space-constrained applications. Compare the 1.5M gate count against alternative models like the M1AFS1500 series to ensure the ARM core integration meets specific processing needs. Verify that the 1.5V I/O standards align with the target system's peripheral voltage requirements.
This device belongs to the Microchip Fusion FPGA family, which combines high-performance programmable logic with embedded processors. Originally developed by Actel before its acquisition by Microchip, the Fusion line is characterized by its use of non-volatile Flash technology, eliminating the need for external configuration PROMs. This architecture provides enhanced security and reduced system complexity compared to traditional SRAM-based FPGAs.
Direct pin-to-pin replacements include other variants within the AFS1500 family, such as the AFS1500-FFGG256I, provided the package pitch and thermal characteristics match. Cross-family migration to PolarFire or IGLOO2 requires schematic and firmware redesign due to architectural differences. Always verify that any substitute part maintains the same industrial temperature rating and voltage specifications.