AFS1500-FG484I

AFS1500-FG484I

$695.02
  • Description:IC FPGA 223 I/O 484FBGA
  • Series:Fusion®

SKU:914c61ee1cd1 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 223 I/O 484FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:276480
  • Number of I/O:223
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:484-BGA
  • Supplier Device Package:484-FPBGA (23x23)
  • Number of Gates:1500000

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AFS1500-FG484I

Overview

The AFS1500-FG484I is a Fusion field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 1.5 million system gates and operates within an industrial temperature range of -40°C to +100°C. The device utilizes a 484-pin FineLine BGA package with surface-mount installation. It supports data rates up to 667 Mb/s and includes four high-speed transceivers. The core logic voltage ranges from 1.14 V to 1.26 V, while I/O voltages support multiple standards. The component is classified under programmable logic ICs and belongs to the Fusion product family.

Feature Summary

  • Integrates 1.5 million system gates for complex digital logic implementation
  • Includes four embedded high-speed serial transceivers for communication interfaces
  • Supports industrial operating temperatures ranging from -40°C to +100°C
  • Utilizes a 484-pin FBGA package for compact surface-mount integration

Applications

  • Industrial automation control systems
  • Telecommunications infrastructure equipment
  • Test and measurement instrumentation
  • Aerospace and defense avionics subsystems

Procurement Notes

Verify the exact suffix configuration against official Microchip documentation to ensure correct temperature grade and package variant. Confirm humidity sensitivity level requirements for your assembly process. Check for any export control classifications or specific compliance certifications required for your region before finalizing procurement orders.

Selection Notes

Compare the 1.5M gate count against your design complexity requirements. Ensure the 484-pin pitch matches your PCB footprint constraints. Verify that the available I/O count and transceiver specifications meet your interface needs. Consider thermal management solutions suitable for the FBGA-484 package in your target application environment.

Part Context

This component belongs to the Microchip Fusion FPGA family, which combines flash-based non-volatile memory with programmable logic. The AFS1500 variant offers high density suitable for demanding applications. It shares the FG484 package style with other devices in the series but differs in gate count and internal architecture compared to lower-density models.

Replacement Considerations

Direct substitutes include other AFS1500 variants with compatible pinouts. Verify if alternative packages like FGG484K are functionally equivalent for your design. Cross-reference with M2GL or MPF series only if gate counts and I/O requirements allow for architectural adjustments.

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