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The AFS1500-FGG256I is a Fusion FPGA from Microchip Technology, featuring 600,000 system gates and packaged in a 256-pin FBGA. It operates within an industrial temperature range of -40°C to +85°C with a supply voltage between 1.425 V and 1.575 V. The device utilizes a non-volatile Flash-based CMOS process, enabling live at power-up functionality without external configuration memory. Key specifications include support for in-system programming via JTAG with AES security and embedded user flash memory options.
Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) as defined in the official datasheet. Confirm package details match the 256-lead Fine-Pitch Ball Grid Array (FBGA) specification. Check for any export control classifications or moisture sensitivity level requirements relevant to your region before ordering.
Select this component when non-volatile configuration and high reliability are required without external boot ROMs. Compare gate counts against other Fusion series parts if higher logic density is needed. Ensure the 256-pin FBGA footprint fits the target PCB layout constraints. Verify that the 1.5 V core voltage aligns with the system's I/O voltage requirements.
This part belongs to the Microchip Fusion FPGA family, which combines Flash-based programmability with optional ARM processor integration. The AFS1500 variant represents a mid-range logic density option within the series, designed for applications balancing performance, power efficiency, and security features inherent to Flash technology.
Direct substitutes may include other AFS1500 variants with different package options such as AFS1500-FFGG256I. Cross-series migration to IGLOO or ProASIC families requires significant design changes due to architectural differences. Always verify pinout compatibility and thermal characteristics before substituting.