AFS1500-FGG256K

Overview

The AFS1500-FGG256K is a Fusion field-programmable gate array (FPGA) manufactured by Microchip Technology. It features 1,500,000 system gates and utilizes a 130-nm CMOS process. The device operates within a supply voltage range of 1.42 V to 1.58 V, with a nominal rating of 1.5 V. It supports an industrial temperature range from -40°C to +85°C. The component is housed in a 256-pin FineLine BGA package with a 1 mm pitch. Key specifications include 119 I/Os and embedded user flash memory.

Feature Summary

• Nonvolatile Flash-based architecture enabling live at power-up functionality without external configuration memory.
• Integrated on-chip 1.5 V regulator allowing operation from a single 3.3 V power supply.
• Supports in-system programming and secure ISP via JTAG with 128-bit AES encryption.
• Includes FlashLock technology to protect FPGA contents from unauthorized access.

Applications

• Industrial control systems requiring nonvolatile reprogrammability.
• Embedded applications needing secure boot and data protection.
• Mixed-signal signal processing using optional ARM support.

Procurement Notes

Verify the specific suffix 'K' against official Microchip documentation to confirm if it denotes a specific packaging or environmental variant distinct from the standard FGG256I. Confirm RoHS compliance status as some Fusion devices may have varying regulatory classifications. Check for active production status and lead times directly with authorized distributors, as older FPGA families may face obsolescence risks.

Selection Notes

Select this model when a high-density, nonvolatile FPGA with integrated security features is required. Ensure the design accommodates the 1.5 V core voltage and 3.3 V I/O requirements if utilizing the internal regulator. Compare gate counts and I/O availability against alternative Fusion parts like the U1AFS1500 if mixed-signal or ARM integration is not needed.

Part Context

This part belongs to the Microchip Fusion family, which combines Flash-based FPGA fabric with optional embedded processors. It succeeds earlier Actel ProASIC technologies, offering higher density and lower power consumption through its 130-nm process. The Fusion series is designed for applications demanding instant-on capability and robust security in a compact footprint.

Replacement Considerations

Direct pin-compatible replacements within the same package are limited due to specific logic density variations. Consider the U1AFS1500-FGG256 for similar gate counts but verify I/O mapping differences. Cross-family migration to SmartFusion or IGLOO II requires schematic redesign due to architectural changes.