AFS250-1FG256

$102.75

Description：IC FPGA 114 I/O 256FBGA
Series：Fusion®

SKU:5d43c983502e Category: FPGAs (Field Programmable Gate Array) Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IC FPGA 114 I/O 256FBGA
Series：Fusion®
Mfr：Microchip Technology
Package：Tray
Number of LABs/CLBs：-
Number of Logic Elements/Cells：-
Total RAM Bits：36864
Number of I/O：114
Voltage - Supply：1.425V ~ 1.575V
Mounting Type：Surface Mount
Operating Temperature：0°C ~ 85°C (TJ)
Package / Case：256-LBGA
Supplier Device Package：256-FPBGA (17x17)
Number of Gates：250000

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AFS250-1FG256

Overview

The AFS250-1FG256 is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 38,400 configurable logic blocks (CLBs). It operates within an industrial temperature range of -40°C to +85°C. The device utilizes a 256-pin FineLine BGA package with a 1mm pitch. Supply voltage requirements are specified between 1.42V and 1.58V, with a nominal rating of 1.5V. This component supports high-speed data rates up to 700Mb/s and includes integrated memory capabilities for embedded applications.

Feature Summary

Supports advanced mezzanine card configurations via MicroBlade compatibility
Integrates ARM Cortex-M1 processor cores for mixed-signal processing
Provides non-volatile flash-based configuration for instant-on functionality

Applications

Industrial automation control systems
Telecommunications infrastructure equipment
Automotive electronic control units

Procurement Notes

Verify export compliance documentation requirements prior to ordering, as this product may require additional files for shipment from the United States. Confirm moisture sensitivity level handling procedures upon receipt to ensure proper storage conditions are maintained before soldering. Check current RoHS status as specifications may vary by manufacturing batch.

Selection Notes

Compare gate counts and I/O availability against design requirements to ensure adequate resource utilization. Evaluate power supply constraints to confirm compatibility with the 1.5V operating voltage range. Assess thermal management needs based on the industrial temperature grade and expected load conditions during operation.

Part Context

This part belongs to the Microchip Fusion FPGA family, which combines flash technology with embedded processor cores. It is designed for applications requiring low power consumption and high reliability. The FG256 suffix indicates the specific 256-pin FineLine BGA package type used for surface mount assembly.