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The AFS250-1FG256I is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 38,400 configurable logic blocks (CLBs). It operates within an industrial temperature range of -40°C to +85°C. The device utilizes a 256-pin FBGA package with a 1 mm pitch. Supply voltage ranges from 1.42 V to 1.58 V, with a nominal rating of 1.5 V. It supports up to 1.5 million equivalent gates and includes moisture sensitivity classification.
Verify the specific suffix '1' indicates the speed grade and '-I' denotes the industrial temperature range upon ordering. Confirm RoHS compliance status as documentation may vary by manufacturing date. Check for export control requirements if shipping from restricted regions. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Validate pinout compatibility with existing PCB footprints before procurement.
Select this component when 250K system gates and 38,400 CLBs are required for complex logic designs. Compare against the M1AFS250 variant if military temperature ratings or ARM Cortex-M1 integration are necessary. Consider the AGL series for lower power consumption needs in non-critical applications. Verify that the 256-pin FBGA package fits the mechanical constraints of the target enclosure.
This part belongs to the Microchip Fusion FPGA family, which combines SRAM-based flexibility with flash-like non-volatility features. It sits between the ProASIC3 low-power line and the PolarFire ultra-low-power series in terms of performance density. The AFS250 model specifically targets applications requiring moderate logic capacity with robust I/O capabilities.
Publicly confirmed direct substitutes include the U1AFS250-FG256I for updated feature sets. The M1AFS250-2FG256 offers similar gate counts but with different temperature and core specifications. Cross-reference datasheets for pin-to-pin compatibility before substitution.