AFS250-1FG256I

AFS250-1FG256I

$177.93
  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®

SKU:dafe385ec0d0 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA 114 I/O 256FBGA
  • Series:Fusion®
  • Mfr:Microchip Technology
  • Package:Tray
  • Number of LABs/CLBs:-
  • Number of Logic Elements/Cells:-
  • Total RAM Bits:36864
  • Number of I/O:114
  • Voltage - Supply:1.425V ~ 1.575V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FPBGA (17x17)
  • Number of Gates:250000

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AFS250-1FG256I

Overview

The AFS250-1FG256I is a Fusion FPGA from Microchip Technology, featuring 250K system gates and 38,400 configurable logic blocks (CLBs). It operates within an industrial temperature range of -40°C to +85°C. The device utilizes a 256-pin FBGA package with a 1 mm pitch. Supply voltage ranges from 1.42 V to 1.58 V, with a nominal rating of 1.5 V. It supports up to 1.5 million equivalent gates and includes moisture sensitivity classification.

Feature Summary

  • Integrates MicroBlade Advanced Mezzanine architecture for high-density programmable logic
  • Supports industrial-grade environmental operation conditions
  • Utilizes surface-mount FBGA packaging for compact board integration

Applications

  • Industrial automation control systems
  • Telecommunications infrastructure interfaces
  • Automotive electronic subsystems

Procurement Notes

Verify the specific suffix '1' indicates the speed grade and '-I' denotes the industrial temperature range upon ordering. Confirm RoHS compliance status as documentation may vary by manufacturing date. Check for export control requirements if shipping from restricted regions. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Validate pinout compatibility with existing PCB footprints before procurement.

Selection Notes

Select this component when 250K system gates and 38,400 CLBs are required for complex logic designs. Compare against the M1AFS250 variant if military temperature ratings or ARM Cortex-M1 integration are necessary. Consider the AGL series for lower power consumption needs in non-critical applications. Verify that the 256-pin FBGA package fits the mechanical constraints of the target enclosure.

Part Context

This part belongs to the Microchip Fusion FPGA family, which combines SRAM-based flexibility with flash-like non-volatility features. It sits between the ProASIC3 low-power line and the PolarFire ultra-low-power series in terms of performance density. The AFS250 model specifically targets applications requiring moderate logic capacity with robust I/O capabilities.

Replacement Considerations

Publicly confirmed direct substitutes include the U1AFS250-FG256I for updated feature sets. The M1AFS250-2FG256 offers similar gate counts but with different temperature and core specifications. Cross-reference datasheets for pin-to-pin compatibility before substitution.

AFS250-1FG256IAFS250-1FG256I
$177.93
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